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XPGBWT-L1-0000-00EE7 Datasheet(PDF) 2 Page - Cree, Inc |
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XPGBWT-L1-0000-00EE7 Datasheet(HTML) 2 Page - Cree, Inc |
2 / 30 page Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 2 XLamp® Xp-G2 LED ChArACtEristiCs Characteristics unit Minimum typical Maximum Thermal resistance, junction to solder point °C/W 4 Viewing angle (FWHM) degrees 115 Temperature coefficient of voltage mV/°C -1.8 ESD withstand voltage (HBM per Mil-Std-883D) v 8000 DC forward current mA 1500 Reverse voltage v 5 Forward voltage (@ 350 mA, 85 °C) v 2.8 3.15 Forward voltage (@ 700 mA, 85 °C) v 2.9 Forward voltage (@ 1000 mA, 85 °C) v 3.0 Forward voltage (@ 1500 mA, 85 °C) v 3.1 LeD junction temperature °C 150 |
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Similar Description - XPGBWT-L1-0000-00EE7 |
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