XQEAWT-H0-0000-00000LDE4 datasheet(1/31 Pages) CREE

Part #	XQEAWT-H0-0000-00000LDE4

Description	Cree XLamp XQ-E LEDs

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Manufacturer	CREE [Cree, Inc]

Direct Link	http://www.cree.com/

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Product family data sheet

registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

Cree® XLamp® XQ-E LEDs

XQ-E High Density LEDs

XQ-E High Intensity LEDs

ProDuCt DEsCrIPtIon

The XLamp® XQ-e LeDs are available

in two versions: high density and

high intensity. The XQ-e High Density

LeD enables lighting manufacturers

to significantly reduce the size and

total cost of their LeD luminaires

versus similar performance 3.5-mm

footprint LEDs, without sacrificing

lumen output, efficacy or reliability.

The XQ-e’s combination of optical

symmetry, consistent design across all

configurations and tiny 1.6 mm X 1.6 mm

footprint simplifies manufacturing and

design while providing excellent color

mixing.

The new XQ-e High Intensity LeD uses an

innovativeprimaryopticdesignoptimized

to deliver maximum candela, especially

through narrow-beam secondary optics.

FEAturEs

• Cree’s smallest lighting class LeD:

1.6 mm X 1.6 mm

• Available in high-density &

high-intensity versions for design

flexibility

• Available in 70, 80, & 90 CRI white,

royal blue, blue, green, PC amber,

red-orange, red, photo red & high

efficiency (HE) photo red

• Maximum drive current: 1 A (high

density & high intensity)

• Reflow solderable - JEDEC

J-STD-020C compatible

• Unlimited floor life at

≤ 30 °C/85% RH

• RoHS and ReACh compliant

• UL® recognized component (E349212)

tAbLE oF ContEnts

Characteristics ............................................2

Flux Characteristics - High Density White .3

Flux Characteristics - High Density Color..4

Flux Characteristics - High Intensity

White............................................................6

Flux Characteristics - High Intensity

Color.............................................................7

Relative Spectral Power Distribution .........9

Relative Flux vs. Junction Temperature.. 11

electrical Characteristics......................... 14

Relative Flux vs. Current .......................... 16

Typical Spatial Distribution...................... 19

Thermal Design........................................ 21

Reflow Soldering Characteristics............ 24

Notes ........................................................ 25

Mechanical Dimensions .......................... 27

Tape and Reel........................................... 29

Packaging................................................. 31

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