 2015 Microchip Technology Inc.

DS20005448A-page 3

CL2

1.0

ELECTRICAL CHARACTERISTICS

Note 1: Mounted on FR4 board, 25mm x 25mm x 1.57 mm

Note 1: Mounted on FR4 board, 25mm x 25mm x 1.57 mm

† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is

a stress rating only and functional operation of the device at those or any other conditions above those indicated in the

operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods

may affect device reliability.

DC AND AC CHARACTERISTICS

Parameter

Symbol

Min

Typ

Max

Units Conditions

Operating voltage

5.0

-

90

V

---

Current regulation

18.0

20

22

mA

-

0.01

-

Operating junction temperature

-40

-

125

°C

---

Dynamic resistance

-300

-

kΩ

---

TEMPERATURE SPECIFICATIONS

Parameter

Symbol

Min

Typ

Max

Units Conditions

Temperature Ranges

Operating Junction Temperature

-40

–

125

°C

Storage Temperature

-55

–

150

°C

Package Thermal Resistances

Thermal Resistance, TO-92

–

132

–

°C/W

Thermal Resistance, TO-252

–81

–

°C/W Note 1

Thermal Resistance, TO-243AA

–

133

–

°C/W Note 1

TABLE 1-1:

THERMAL CHARACTERISTICS

Package

Power Dissipation

Conditions

TO-92

0.6

TO-252

2.0

Note 1

TO-243AA

1.3

Note 1