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NCV8184PDG Datasheet(PDF) 11 Page - ON Semiconductor |
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NCV8184PDG Datasheet(HTML) 11 Page - ON Semiconductor |
11 / 20 page NCV8184 http://onsemi.com 11 PACKAGE THERMAL DATA Parameter Conditions Typical Value Units SOIC−8 EP Package 100 mm2 Spreader Board 645 mm2 Spreader Board 1 oz 2 oz 1 oz 2 oz Junction−to−Board (Y−JB, YJB) 26 26 26 25 °C/W Junction−to−Pin 6 (tab) (Y−JL6, YJL6) 48 45 37 34 °C/W Junction−to−Ambient (RqJA, qJA) 140 123 88 78 °C/W Figure 28. PCB Layout and Package Construction for Simulation Package construction Without mold compound |
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