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NCV7428 Datasheet(PDF) 4 Page - ON Semiconductor |
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NCV7428 Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 19 page NCV7428 www.onsemi.com 4 Table 3. ABSOLUTE MAXIMUM RATINGS Symbol Parameter Min Max Units VS Maximum DC voltage at VS pin −0.3 45 V VOUT Maximum voltage at VOUT pin −0.3 6 V VLIN Maximum voltage at LIN bus pin −45 45 V VDig_IO_inputs Maximum voltage at digital input pins (TxD, EN) −0.3 45 V VDig_IO_outputs Maximum voltage at digital output pins (RxD, RSTN) −0.3 VOUT+0.3 V TAMB Ambient temperature range −40 +125 °C TJ Junction temperature range −40 +170 °C TSTG Storage temperature range −55 +150 °C VESD System ESD at pins VS, LIN as per IEC 61000−4−2: 330 W / 150 pF (Verified by external test house) ≥ ±14 kV Human body model at pins VS, LIN stressed towards GND with 1500 W / 100 pF ≥ ±8 kV Human body model at all pins as per JESD22−A114 / AEC−Q100−002 ≥ ±4 kV Charge device model at all pins as per JESD22−C101 / AEC−Q100−011 ≥ ±500 V Machine model; (200 pF; 0.75 mH; 10 W) as per JESD22−A115 / AEC−Q100−003 ±200 V MSL Moisture Sensitivity Level SOIC DFN 2 1 − TSLD Lead temperature Soldering − Reflow (SMD styles only), Pb−Free (Note 1) 260 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Table 4. OPERATING RANGES Symbol Parameter Min Max Units VS VS operating voltage for parametric operation (Note 2) 5.5 28 V VS operating voltage for limited operation (Note 2) 4 28 V VOUT5 Regulated voltage at VOUT supply output for 5 V versions 4.9 5.1 V VOUT33 Regulated voltage at VOUT supply output for 3.3 V versions 3.234 3.366 V IVOUT Current delivered by the VOUT regulator 70 mA VLIN Operating voltage at LIN bus pin 0 VS V VDig_IO_inputs Operating voltage at digital input pins (TxD, EN) 0 5.5 V VDig_IO_outputs Operating voltage at digital output pins (RxD, RSTN) 0 VOUT V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 2. Below 5.5 V at VS pin in normal mode, the bus will either stay recessive or comply with the voltage level specifications and transition time specifications as required by SAE J2602. It is ensured by the battery monitoring circuit. Above 28 V at VS pin, LIN communication is operational (LIN pin toggling) but parameters cannot be guaranteed. For higher battery voltage operation above 28 V, LIN pull−up resistor must be selected large enough to avoid clamping of LIN pin by voltage drop over external pull−up resistor and LIN pin min current limitation. Table 5. THERMAL CHARACTERISTICS Rating Symbol Value Unit Thermal Characteristics, SOIC−8 (Note 3) Thermal Resistance Junction−to−Air, Free air, 1S0P PCB (Note 4) Thermal Resistance Junction−to−Air, Free air, 2S2P PCB (Note 5) RqJA RqJA 125 75 °C/W °C/W Thermal Characteristics, DFN−8 (Note 3) Thermal Resistance Junction−to−Air, Free air, 1S0P PCB (Note 4) Thermal Resistance Junction−to−Air, Free air, 2S2P PCB (Note 5) RqJA RqJA 133 55 °C/W °C/W 3. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for Safe Operating parameters. 4. Values based on test board according to EIA/JEDEC Standard JESD51−3, signal layer with 10% trace coverage. 5. Values based on test board according to EIA/JEDEC Standard JESD51−7, signal layers with 10% trace coverage for the signal layer and 4 thermal vias connected between exposed pad and first inner Cu layer. |
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