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5962R8754903VDA Datasheet(PDF) 4 Page - Texas Instruments

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Part No. 5962R8754903VDA
Description  SN54AC00-SP Radiation Hardened Quad 2 Input NAND Gate
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Maker  TI1 [Texas Instruments]
Homepage  http://www.ti.com
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5962R8754903VDA Datasheet(HTML) 4 Page - Texas Instruments

 
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SN54AC00-SP
SCHS367B – OCTOBER 2008 – REVISED FEBRUARY 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VCC
Supply voltage
–0.5
7
V
VI
Input voltage(2)
–0.5
VCC + 0.5
V
VO
Output voltage(2)
–0.5
VCC + 0.5
V
IIK
Input clamp current
VI < 0 or VI > VCC
±20
mA
IOK
Output clamp current
VO < 0 or VO > VCC
±20
mA
IO
Continuous output current
VO = 0 to VCC
±50
mA
Continuous current through VCC or GND
±200
mA
TJ
Junction temperature
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
6.2 Recommended Operating Conditions
MIN
MAX
UNIT
VCC
Supply voltage
2
6
V
VCC = 3 V
2.1
VIH
High-level input voltage
VCC = 4.5 V
3.15
V
VCC = 5.5 V
3.85
VCC = 3 V
0.9
VIL
Low-level input voltage
VCC = 4.5 V
1.35
V
VCC = 5.5 V
1.65
VI
Input voltage
0
VCC
V
VO
Output voltage
0
VCC
V
VCC = 3 V
12
IOH
High-level output current
VCC = 4.5 V
24
mA
VCC = 5.5 V
24
VCC = 3 V
12
IOL
Low-level output current
VCC = 4.5 V
24
mA
VCC = 5.5 V
24
Δt/Δv
Input transition rise or fall rate
8
ns/V
TA
Operating free-air temperature
–55
125
°C
6.3 Thermal Information
SN54AC00-SP
THERMAL METRIC(1)(2)
J
W
UNIT
14 PINS
14 PINS
RθJA
Junction-to-ambient thermal resistance
83.1
125.4
RθJC(top)
Junction-to-case (top) thermal resistance
26.6
30.85
RθJB
Junction-to-board thermal resistance
47.9
43.4
°C/W
ψJT
Junction-to-top characterization parameter
N/A
N/A
ψJB
Junction-to-board characterization parameter
N/A
N/A
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
The package thermal impedance is calculated in accordance with JESD 51-7 and Mil Std 883 method 1012.1 (see www.JEDEC.org).
4
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Copyright © 2008–2015, Texas Instruments Incorporated
Product Folder Links: SN54AC00-SP


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