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5962R8754903VDA Datasheet(PDF) 3 Page - Texas Instruments |
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5962R8754903VDA Datasheet(HTML) 3 Page - Texas Instruments |
3 / 10 page SN54AC00-SP www.ti.com SCHS367B – OCTOBER 2008 – REVISED FEBRUARY 2015 5 Bare Die Information BACKSIDE BOND PAD DIE THICKNESS BACKSIDE FINISH BOND PAD THICKNESS POTENTIAL METALLIZATION COMPOSITION 15 mils Silicon with backgrind Floating TiW/AlCu2 15800 nm Bond Pad Coordinates in Microns DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX 1A 1 96.3 510.5 201.3 615.5 1B 2 95 94 200 199 1Y 3 508 94 613 199 2A 4 1149 94 1254 199 2B 5 1562 94 1667 199 2Y 6 1841.5 145.5 1946.5 250.5 GND 7 1841.5 445.5 1946.5 550.5 3Y 8 1841 783 1946 888 3A 9 1750.5 991 1855.5 1096 3B 10 1176.5 991 1281.5 1096 4Y 11 921 991 1026 1096 4A 12 736 991 841 1096 4B 13 95 991 200 1096 VCC 14 102.5 692 207.5 797 Copyright © 2008–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: SN54AC00-SP |
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