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TPS799-Q1 Datasheet(PDF) 14 Page - Texas Instruments

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Part No. TPS799-Q1
Description  200 mA, Low Quiescent Current, Ultralow Noise, High PSRR, Low Dropout, Linear Regulators
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TPS799-Q1 Datasheet(HTML) 14 Page - Texas Instruments

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background image
D
IN
OUT
OUT
P
(V
V
) I
=
-
´
CIN
COUT
CNR
GND
VI
VO
TPS799
Represents via used for
application specific connections.
EN
TPS799-Q1
SBVS097F – MARCH 2008 – REVISED JUNE 2015
www.ti.com
10.2 Layout Example
Figure 15. Layout Example
10.3 Thermal Consideration
Thermal protection disables the output when the junction temperature rises to approximately 165°C, allowing the
device to cool. When the junction temperature cools to approximately 145°C, the output circuitry is again
enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection
circuit may cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage due to
overheating.
Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate
heatsink. For reliable operation, junction temperature should be limited to 125°C maximum. To estimate the
margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal
protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection should
trigger at least 35°C above the maximum expected ambient condition of your particular application. This
configuration produces a worst-case junction temperature of 125°C at the highest expected ambient temperature
and worst-case load.
The internal protection circuitry of the TPS799xx-Q1 has been designed to protect against overload conditions. It
was not intended to replace proper heatsinking. Continuously running the TPS799xx-Q1 into thermal shutdown
degrades device reliability.
10.4 Power Dissipation
The ability to remove heat from the die is different for each package type, presenting different considerations in
the PCB layout. The PCB area around the device that is free of other components moves the head from the
device to the ambient air. Performance data for JEDEC low- and high-K boards are given in the Thermal
Information table. Using heavier copper increases the effectiveness in removing heat from the device. The
addition of plated through holes to heat-dissipating layers also improves the heatsink effectiveness.
Power dissipation depends on input voltage and load conditions. Power dissipation is equal to the product of the
output current times the voltage drop across the output pass element, as shown in Equation 2:
(2)
10.5 Package Mounting
Solder pad footprint recommendations for the TPS799xx-Q1 are available from the TI website at www.ti.com.
14
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Copyright © 2008–2015, Texas Instruments Incorporated
Product Folder Links: TPS799-Q1


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