TPS799-Q1 datasheet(4/25 Pages) TI1 | 200 mA, Low Quiescent Current, Ultralow Noise, High PSRR, Low Dropout, Linear Regulators

Part No.	TPS799-Q1

Description	200 mA, Low Quiescent Current, Ultralow Noise, High PSRR, Low Dropout, Linear Regulators

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Manufacturer	TI1 [Texas Instruments]

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TPS799-Q1

SBVS097F – MARCH 2008 – REVISED JUNE 2015

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

over operating temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN

–0.3

7

V

VEN

–0.3

VIN + 0.3

V

VOUT

–0.3

VIN + 0.3

V

Peak output current

Internally limited

Continuous total power dissipation

See Thermal Information

Junction temperature, TJ

–55

150

°C

Storage junction temperature, Tstg

–55

150

°C

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per AEC Q100-002(1)

±2000

V(ESD)

Electrostatic discharge

V

Charged device model (CDM), per AEC Q100-011

±1000

(1)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input voltage

2.7

6.5

V

IOUT

Output current

0.5

200

mA

TJ

Operating junction temperature

–40

125

°C

6.4 Thermal Information

TPS799xx-Q1

THERMAL METRIC(1)(2)

DRV (SON)

DDC (SOT-23)

UNIT

6 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

74.2

178.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

58.8

70.7

°C/W

RθJB

Junction-to-board thermal resistance

145.9

73.4

°C/W

ψJT

Junction-to-top characterization parameter

0.2

2.5

°C/W

ψJB

Junction-to-board characterization parameter

54.4

74.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

7.2

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.

4

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