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TPS74901 Datasheet(PDF) 24 Page - Texas Instruments
TI1 [Texas Instruments]
SBVS082I – JUNE 2007 – REVISED MAY 2016
Product Folder Links: TPS74901
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11 Device and Documentation Support
11.1 Device Support
11.1.1 Development Support
220.127.116.11 Evaluation Modules
An evaluation module (EVM) is available to assist in the initial circuit performance evaluation using the TPS48.
The TPS74901EVM-210 evaluation module and related user's guide (SLVU190) can be requested at the Texas
Instruments website through the product folders or purchased directly from the TI eStore.
18.104.22.168 Spice Models
Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of
analog circuits and systems. A SPICE model for the TPS748 is available through the product folders under Tools
11.2 Documentation Support
11.2.1 Related Documentation
For related documentation, see the following:
Using New Thermal Metrics, SBVA025
IC Package Thermal Metrics, SPRA953
Ultimate Regulation of with Fixed Output Versions of the TPS742xx, TPS743xx, and TPS744xx, SBVA024
Pros and Cons of Using a Feedforward Capacitor with a Low-Dropout Regulator, SBVA042
TPS74901EVM-210 Evaluation Module User Guide, SLVU190
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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