IFX7805

General Product Characteristics

Datasheet

7

Rev. 1.0, 2013-07-15

4.3

Thermal Resistance

Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go

to www.jedec.org.

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Typ.

Max.

PG-TO-252-3

4.3.1

1) Not subject to production test, specified by design.

R

thJC

–

4–K/W

–

4.3.2

Junction to Ambient

R

thJA

–27

–

K/W

2) Specified

R

4.3.3

–

113

–

K/W

Footprint Only

4.3.4

–

52

–

K/W

3) Specified

R

4.3.5

–

42

–

K/W

area on PCB

PG-TO-263-3

4.3.6

Junction to Case

R

thJC

–

4–K/W

–

4.3.7

Junction to Ambient

R

thJA

–23

–

K/W

–

4.3.8

–

76

–

K/W

Footprint Only

4.3.9

–

44

–

K/W

area on PCB

4.3.10

–

35

–

K/W

area on PCB

PG-TO-220-3

4.3.11

Junction to Case

R

thJC

–

4–K/W

–

4.3.12

Junction to Ambient

R

thJA

–41

–

K/W

–

4.3.13

–

91

–

K/W

Footprint Only

4.3.14

–

63

–

K/W

area on PCB

4.3.15

–

58

–

K/W

area on PCB