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CFP-0811TB Datasheet(PDF) 3 Page - Copal Electronics |
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CFP-0811TB Datasheet(HTML) 3 Page - Copal Electronics |
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3 / 5 page  CFP PIANO SWITCHES (FULL PITCH) ■ STANDARD SPECIFICATIONS Operating temp. range Storage temp. range Sealing Net weight − 40 ~ 85 °C Non-washable Approx. 0.55 g (CFP-02) Approx. 0.86 g (CFP-04) Approx. 1.19 g (CFP-06) Approx. 1.90 g (CFP-10) Approx. 0.70 g (CFP-03) Approx. 1.03 g (CFP-05) Approx. 1.54 g (CFP-08) Operation angle Operation force Stop strength Solderability Soldering heat Shear (Adhesion) Substrate bending Pull-off strength 21 ° 7 N {0.71 kgf} maximum 10 N {1.02 kgf} 60 s 245 ± 3 °C, 2 ~ 3 s 5 N {0.51 kgf} 10 s Width 90 mm, bend 3 mm, 5 s, 1 time 5 N {0.51 kgf} 10 s ■ MECHANICAL CHARACTERISTICS Contact rating Non-switching Switching Minimum Contact resistance Insulation resistance Dielectric strength DC50 V 100 mA DC6 V, 100 mA DC24 V, 25 mA DC20 mV 1 μA 50 m Ω maximum 1000 M Ω (DC100 V) minimum AC500 V, 60 s Vibration Shock Load life Humidity High temp. exposure Low temp. exposure Thermal shock Amplitude 1.5 mm or Acceleration 98 m/s 2, 10-500 Hz, 3 directions for 10 cycles each 490 m/s 2, 11 ms, 6 directions for 3 times each Continuous load 1000 cycles, DC6 ± 0.5 V, 100 ± 10 mA −10 ~ 65 °C, Relative humidity 0 ~ 96 %, 24 h for 10 cycles 85 °C, 96 h −40 °C, 96 h −40 (0.5 h) ~ 85 °C (0.5 h), 5 cycles ■ ELECTRICAL CHARACTERISTICS ■ ENVIRONMENTAL CHARACTERISTICS { } : Reference only Flow ：260 ± 3 °C, 5 ~ 6 s, two times maximum Reflow ：255 °C (Peak temperature) （Please refer to the profile below ） Manual soldering ：350 ± 10 °C, 3 ~ 4 s Reflow profile for soldering heat evaluation〉 Reflow : two times maximum Peak : 250 Over 230 ℃ Pre Heating Zone 180 C ( ℃) 250 200 150 100 50 150 C 90±30 s 30±10 s Soldering Zone Heating time ℃ +5 0 |
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