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C0BQ-3N6-10 Datasheet(PDF) 5 Page - Superworld Electronics |
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C0BQ-3N6-10 Datasheet(HTML) 5 Page - Superworld Electronics |
5 / 8 page NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 28.01.2015 C0BQ SERIES 8. SOLDERING AND MOUNTING : 8-1. Recommended PC Board Pattern If wave soldering is used ,there will be some risk. 8-2.2 Soldering Iron (Figure 2) : 8-2.1 Lead Free Solder Re-flow : Note. cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with soldering iron is discouraged due to the inherent process Control limitations. In the event that a) Preheat circuit and products to 150° C. b) 350° C tip temperature (max) c) Never Contact the ceramic with the iron tip a soldering iron must be employed the following precautions are reCommended. Note : 8-2. Soldering e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 4 ~ 5 secs. d) 1.0mm tip diameter (max) under mechanical stress as warping the board. the mechanical stress to prevent failure. Products shall be positioned in the sideway direction against PC board should be designed so that products are not sufficient Figure 2. Hand Soldering : 1 times max G rad ual C0oling Over 1min. 350 150 Preheating Soldering Cooling Natural Within 4~5s L G Figure 1. Re-flow Soldering : 3 times max Time(sec.) 60~150s 20~40s Soldering 4 80s max. 60~180s 150 25 TP(260° C/40s max.) 217 200 Preheating Cooling Natural CERAMIC CHIP INDUCTORS 0.20~0.30 GH Unit:m/m 0.80 L 0.25~0.40 Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk |
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