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HFCT-5208A Datasheet(PDF) 8 Page - Agilent(Hewlett-Packard) |
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HFCT-5208A Datasheet(HTML) 8 Page - Agilent(Hewlett-Packard) |
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8 / 21 page  7 (0.25 in) . With this option, there is flexibility of positioning the module to fit the specific need of the enclosure design. (See Figure 8 for the mechanical drawing dimensions of this shield.) The second shielded option, option FM, is for applications that are designed to have a flush mounting of the module with respect to the front of the panel or enclosure. The flush-mount design accommodates a large variety of panel thickness, i.e. 1.02 mm (.04 in) min to 2.54 mm (0.1 in) max. Note the reference plane for the flush-mount design is the interior side of the panel or enclosure. The recommended distance from the centerline of the transceiver front solder posts to the inside wall of the panel is 13.82 mm (0.544 in) . This option contacts the inside panel or enclosure wall on all four sides of this metal shield. (See Figure 10 for the mechanical drawing dimensions of this shield.) Both shielded design options connect only to the equipment chassis and not to the signal or logic ground of the circuit board within the equipment closure. The front panel aperture dimensions are recommended in Figures 9 and 11. When layout of the printed circuit board is done to incorporate these metal-shielded transceivers, keep the area on the printed circuit board directly under the external metal shield free of any components and circuit board traces. For additional EMI performance advantage, use duplex SC fiber- optic connectors that have low metal content inside the connector. This lowers the ability of the metal fiber-optic connectors to couple EMI out through the aperture of the panel or enclosure. Recommended Solder and Wash Process The HFBR/HFCT-5208M is compatible with industry-standard wave or hand solder processes. HFBR-5000 Process Plug The HFBR/HFCT-5208M transceiver is supplied with a process plug, the HFBR-5000, for protection of the optical ports with the Duplex SC connector receptacle. This process plug prevents contamination during wave solder and aqueous rinse as well as during handling, shipping or storage. It is made of high- temperature, molded, sealing material that will withstand +85°C and a rinse pressure of 110 lb/in2. Recommended Solder Fluxes and Cleaning/Degreasing Chemicals Solder fluxes used with the HFBR/HFCT-5208M fiber-optic transceiver should be water- soluble, organic solder fluxes. Some recommended solder fluxes are Lonco 3355-11 from London Chemical West, Inc. of Burbank, CA, and 100 Flux from Alpha- metals of Jersey City, NJ or equivalent fluxes from other companies. Recommended cleaning and degreasing chemicals for the HFBR/HFCT-5208M are alcohols (methyl, isopropyl, isobutyl), aliphatics (hexane, heptane) and other chemicals, such as soap solution or naphtha. Do not use partially halogenated hydrocarbons for cleaning/ degreasing. Examples of chemicals to avoid are 1,1.1 trichloroethane, ketones (such as MEK), acetone, chloroform, ethyl acetate, methylene dichloride, phenol, methylene chloride or N methylpyrolldone. Regulatory Compliance These transceiver products are intended to enable commercial system designers to develop equipment that complies with the various regulations governing certification of Information Technology Equipment. See the Regulatory Compliance Table for details. Additional information is available from your Agilent sales representative. Electrostatic Discharge (ESD) There are two design cases in which immunity to ESD damage is important. The first case is during handling of the transceiver prior to mounting it on the circuit board. It is important to use normal ESD handling precautions for ESD sensitive devices. These precautions include using grounded wrist straps, work benches, and floor mats in ESD controlled areas, etc. The second case to consider is static discharges to the exterior of the equipment chassis containing the transceiver parts. To the extent that the duplex SC connector receptacle is exposed to the outside of the equipment chassis, it may be subject to whatever ESD system level test criteria that the equipment is intended to meet. Electromagnetic Interference (EMI) Most equipment designs utilizing these high-speed transceivers from Agilent will be required to meet the requirements of FCC in the United States, CENELEC EN55022 (CISPR 22) in Europe and VCCI in Japan. The HFBR/HFCT-5208M EMI has been characterized with a chassis enclosure to demonstrate the robustness of the parts. Performance of a system containing these transceivers will vary depending on the individual chassis design. |
Similar Part No. - HFCT-5208A |
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Similar Description - HFCT-5208A |
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