NCP367

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3

PIN FUNCTION DESCRIPTION

Pin

Name

Type

Description

1

IN

POWER

Input Voltage Pin. This pin is connected to the power supply: Wall Adapter or USB. A 1

mF low ESR

ceramic capacitor, or larger, must be connected between this pin and GND.

2

INPUT

Li ion Battery voltage sense pin. A serial resistor must be placed between this pin and positive pin of

the battery pack.

3

NC

OUTPUT

Not Connected

4

OUTPUT

Current Limit Pin. This pin provides the reference, based on the internal band−gap voltage reference, to

limit the overcurrent, across internal PMOSFET, from IN to OUT. A 1% tolerance, or better, resistor

shall be used to get the highest accuracy of the Overcurrent Limit.

5

EN

INPUT

Enable Mode Pin. The device enters in shutdown mode when this pin is tied to a high level. In this case

the output is disconnected from the input. The state of this pin does not have an impact on the fault

detection of the FLAG pin.

6

GS

INPUT

Gain Select Pin. When the GS pin is tied to 0 level, the Overcurrent threshold is defined by Ilimit set-

ting. See logic table. When GS pin is tied to high, the Overcurrent threshold is set to Ilimit/GS

7

FLAG

OUTPUT

Fault Indication Pin. This pin allows an external system to detect fault condition. The FLAG pin goes

low when input voltage is below UVLO threshold, exceeds OVLO threshold, charge current from wall

adapter to battery exceeds programmed current limit, Li ion Battery voltage (4.3 V) is exceeded or in-

ternal temperature exceeds thermal shutdown limit. Since the FLAG pin is open drain functionality, an

external pull−up resistor to VBattery must be added (10 k

W minimum value).

8

GND

POWER

Ground.

9

OUT

OUTPUT

Output Voltage Pin. This pin follows IN pin when “no input fault” is detected. The output is disconnected

from the Vin power supply when voltage, current or thermal fault events are detected. A 1

mF low ESR

ceramic capacitor, or larger, must be connected between this pin and GND.

NOTE:

Pin out provided for concept purpose only and might change in the final product

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Minimum Voltage (IN to GND)

−0.3

V

Minimum Voltage (All others to GND)

Vmin

−0.3

V

Maximum Voltage (IN to GND)

30

V

Maximum Voltage (All others to GND)

Vmax

7.0

V

Maximum DC Current from Vin to Vout (PMOS)

Imax

3.4

A

Thermal Resistance, Junction−to−Air (without PCB area)

190

°C/W

Operating Ambient Temperature Range

−40 to +85

°C

Storage Temperature Range

−65 to +150

°C

Junction Operating Temperature

150

°C

ESD Withstand Voltage (IEC 61000−4−2)

Human Body Model (HBM), Model = 2 (Note 1)

Machine Model (MM) Model = B (Note 2)

Vesd

15 Air, 8.0 Contact

2000

200

kV

V

V

Latchup

LU

Class 1

−

Moisture Sensitivity

MSL

Level 1

−

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Human Body Model, 100 pF discharged through a 1.5 k

W resistor following specification JESD22/A114.

2. Machine Model, 200 pF discharged through all pins following specification JESD22/A115.