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NCP367DPMEBTBG Datasheet(PDF) 3 Page - ON Semiconductor |
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NCP367DPMEBTBG Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 13 page NCP367 www.onsemi.com 3 PIN FUNCTION DESCRIPTION Pin Name Type Description 1 IN POWER Input Voltage Pin. This pin is connected to the power supply: Wall Adapter or USB. A 1 mF low ESR ceramic capacitor, or larger, must be connected between this pin and GND. 2 VBAT INPUT Li ion Battery voltage sense pin. A serial resistor must be placed between this pin and positive pin of the battery pack. 3 NC OUTPUT Not Connected 4 ILIM OUTPUT Current Limit Pin. This pin provides the reference, based on the internal band−gap voltage reference, to limit the overcurrent, across internal PMOSFET, from IN to OUT. A 1% tolerance, or better, resistor shall be used to get the highest accuracy of the Overcurrent Limit. 5 EN INPUT Enable Mode Pin. The device enters in shutdown mode when this pin is tied to a high level. In this case the output is disconnected from the input. The state of this pin does not have an impact on the fault detection of the FLAG pin. 6 GS INPUT Gain Select Pin. When the GS pin is tied to 0 level, the Overcurrent threshold is defined by Ilimit set- ting. See logic table. When GS pin is tied to high, the Overcurrent threshold is set to Ilimit/GS 7 FLAG OUTPUT Fault Indication Pin. This pin allows an external system to detect fault condition. The FLAG pin goes low when input voltage is below UVLO threshold, exceeds OVLO threshold, charge current from wall adapter to battery exceeds programmed current limit, Li ion Battery voltage (4.3 V) is exceeded or in- ternal temperature exceeds thermal shutdown limit. Since the FLAG pin is open drain functionality, an external pull−up resistor to VBattery must be added (10 k W minimum value). 8 GND POWER Ground. 9 OUT OUTPUT Output Voltage Pin. This pin follows IN pin when “no input fault” is detected. The output is disconnected from the Vin power supply when voltage, current or thermal fault events are detected. A 1 mF low ESR ceramic capacitor, or larger, must be connected between this pin and GND. NOTE: Pin out provided for concept purpose only and might change in the final product MAXIMUM RATINGS Rating Symbol Value Unit Minimum Voltage (IN to GND) Vminin −0.3 V Minimum Voltage (All others to GND) Vmin −0.3 V Maximum Voltage (IN to GND) Vmaxin 30 V Maximum Voltage (All others to GND) Vmax 7.0 V Maximum DC Current from Vin to Vout (PMOS) Imax 3.4 A Thermal Resistance, Junction−to−Air (without PCB area) RqJA 190 °C/W Operating Ambient Temperature Range TA −40 to +85 °C Storage Temperature Range Tstg −65 to +150 °C Junction Operating Temperature TJ 150 °C ESD Withstand Voltage (IEC 61000−4−2) Human Body Model (HBM), Model = 2 (Note 1) Machine Model (MM) Model = B (Note 2) Vesd 15 Air, 8.0 Contact 2000 200 kV V V Latchup LU Class 1 − Moisture Sensitivity MSL Level 1 − Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Human Body Model, 100 pF discharged through a 1.5 k W resistor following specification JESD22/A114. 2. Machine Model, 200 pF discharged through all pins following specification JESD22/A115. |
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