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MBA0204SD6DC100 Datasheet(PDF) 11 Page - Vishay Siliconix |
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MBA0204SD6DC100 Datasheet(HTML) 11 Page - Vishay Siliconix |
11 / 15 page MBA/SMA 0204, MBB/SMA 0207, MBE/SMA 0414 - Professional www.vishay.com Vishay Beyschlag Revision: 02-Nov-15 11 Document Number: 28766 For technical questions, contact: filmresistorsleaded@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TESTS PROCEDURES AND REQUIREMENTS All tests are carried out in accordance with the following specifications: • EN 60115-1, generic specification (includes tests) • EN 140100, sectional specification (includes schedule for qualification approval) • EN 140101-806 (successor of CECC 40101-806), detail specification (includes schedule for conformance inspection) The test and requirements table contains only the most important tests. For the full test schedule refer to the documents listed above. The tests are carried out in accordance with IEC 60068-2-xx test method and under standard atmospheric conditions in accordance with IEC 60068-1, 5.3. Climatic category LCT / UCT / 56 (rated temperature range: lower category temperature, upper category temperature; damp heat, steady state, test duration: 56 days) is valid. Unless otherwise specified the following values apply: • Temperature: 15 °C to 35 °C • Relative humidity: 45 % to 75 % • Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar). For performing some of the tests, the components are mounted on a test board in accordance with IEC 60115-1, 4.31. In Test Procedures and Requirements table, only the tests and requirements are listed with reference to the relevant clauses of IEC 60115-1 and IEC 60068-2-xx test methods. A short description of the test procedure is also given. TEST PROCEDURES AND REQUIREMENTS IEC 60115-1 CLAUSE IEC 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE ( ΔR max.) Stability for product types: STABILITY CLASS 0.5 STABILITY CLASS 1 STABILITY CLASS 2 MBA/SMA 0204 1 Ω to 332 kΩ 0.22 Ω to < 1 Ω > 332 k Ω MBB/SMA 0207 1 Ω to 1 MΩ 0.22 Ω to < 1 Ω > 1 M Ω MBE/SMA 0414 1 Ω to 2.4 MΩ 0.22 Ω to < 1 Ω > 2.4 M Ω 4.5 - Resistance - ± 5 % R; ± 1 % R; ± 0.5 % R 4.7 - Voltage proof URMS = Uins; 60 s No flashover or breakdown 4.8 - Temperature coefficient At (20 / -55 / 20) °C and (20 / 155 / 20) °C ± 50 ppm/K; ± 25 ppm/K 4.13 - Short time overload Room temperature; U = 2.5 x or U = 2 x Umax.; 5 s ± (0.1 % R + 0.01 Ω) no visible damage ± (0.25 % R + 0.05 Ω) no visible damage ± 0.5 % R no visible damage 4.16 21 (Ua1) 21 (Ub) 21 (Uc) Robustness of terminations Tensile, bending, and torsion ± (0.1 % R + 0.01 Ω)± (0.25 % R + 0.05 Ω)± 0.5 % R 4.17 20 (Ta) Solderability +235 °C; 2 s; solder bath method; SnPb40 Good tinning (> 95 % covered, no visible damage) +245 °C; 3 s; solder bath method; SnAg3Cu0.5 4.18.2 20 (Tb) Resistance to soldering heat Unmounted components; (260 ± 5) °C; (10 ± 1) s ± (0.1 % R + 0.01 Ω) no visible damage ± (0.25 % R + 0.05 Ω) no visible damage ± 0.5 % R no visible damage 4.19 14 (Na) Rapid change of temperature 30 min at -55 °C 30 min at 155 °C 5 cycles ± (0.1 % R + 0.01 Ω)± (0.25 % R + 0.05 Ω)± 0.5 % R MBA/SMA 0204: 500 cycles MBB/SMA 0207: 200 cycles MBE/SMA 0414: 100 cycles ± (0.5 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω) 4.22 6 Vibration 10 sweep cycles per direction; 10 Hz to 2000 Hz 1.5 mm or 200 m/s2 ± (0.1 % R + 0.01 Ω)± (0.25 % R + 0.05 Ω)± 0.5 % R 4.23 Climatic sequence: 4.23.2 2 (Ba) Dry heat 155 °C; 16 h 4.23.3 30 (Db) Damp heat, cyclic 55 °C; 24 h; ≥ 90 % to 100 % RH; 1 cycle 4.23.4 1 (Aa) Cold -55 °C; 2 h 4.23.5 13 (M) Low air pressure 8.5 kPa; 2 h; 15 °C to 35 °C 4.23.6 30 (Db) Damp heat, cyclic 55 °C; 5 days; ≥ 95 % to 100 % RH; 5 cycles ± (0.5 % R + 0.05 Ω) no visible damage ± (1 % R + 0.05 Ω) no visible damage ± 2 % R no visible damage 4.23.7 DC load apply rated power for 1 min P 70 x R |
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