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NCV7720DQR2G Datasheet(PDF) 5 Page - ON Semiconductor |
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NCV7720DQR2G Datasheet(HTML) 5 Page - ON Semiconductor |
5 / 26 page NCV7720 www.onsemi.com 5 MAXIMUM RATINGS (Voltages are with respect to GND) Rating Symbol Value Unit VSx Pin Voltage (VS1, VS2) (DC) (AC), t < 500 ms, Ivsx > −2 A VSxdcMax VSxac −0.3 to 40 −1.0 V I/O Pin Voltage ( Vcc, SI, SCLK, CSB, SO, EN) VioMax −0.3 to 5.5 V OUTx Pin Voltage (DC) (AC) (AC), t< 500 ms, IOUTx > −1.1 A (AC), t< 500 ms, IOUTx < 1 A VoutxDc VoutxAc −0.3 to 40 −0.3 to 40 −1.0 1.0 V OUTx Pin Current (OUT1, ..., OUT10) IoutxImax −2.0 to 2.0 A Junction Temperature Range TJ −40 to 150 °C Storage Temperature Range Tstr −55 to 150 °C Peak Reflow Soldering Temperature: Pb−free 60 to 150 seconds at 217 °C (Note 1) 260 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. See or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ATTRIBUTES Characteristic Symbol Value Unit Short Circuit Reliability Characterization AECQ10x Grade A − ESD Capability Human Body Model per AEC−Q100−002 VSx, OUTx All Other Pins Machine Model per AEC−Q100−003 Vesd4k Vesd2k Vesd200 ≥ ±4.0 kV ≥ ±2.0 kV ≥ ±200 V Moisture Sensitivity Level MSL MSL2 − Package Thermal Resistance – Still−air Junction–to–Ambient (Note 2) (Note 3) Junction–to–Board (Note 2) (Note 3) RqJA RqJA RYJBOARD RYJBOARD 54 26 22 14 °C/W °C/W °C/W °C/W 2. Based on JESD51−3, 1.2 mm thick FR4, 2S0P PCB with 2 oz. copper and 18 thermal vias to 600 mm2 spreader on bottom layer. 3. Based on JESD51−7, 1.2 mm thick FR4, 1S2P PCB with 2 oz. copper and 18 thermal vias to 80x80 mm 1 oz. internal spreader planes. RECOMMENDED OPERATING CONDITIONS Parameter Symbol Min Max Unit Digital Supply Input Voltage VCCOp 3.15 5.25 V Battery Supply Input Voltage VSxOp 5.5 28 V DC Output Current IxOp − 0.55 A Junction Temperature TjOp −40 125 °C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. |
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