NCV7708F

www.onsemi.com

4

MAXIMUM RATINGS

Rating

Value

Unit

Power Supply Voltage (VS1, VS2)

(DC)

(AC), t < 500 ms, Ivsx > −2 A

−0.3 to 40

−1.0

V

Output Pin OUTHx

(DC)

(AC – inductive clamping)

−0.3 to 40

−8.0

V

Output Pin OUTLx

(DC)

(AC), t < 500 ms, IOUTLx > −2 A

(AC Inductive Clamping)

−0.3 to 36

−1.0

45

V

−0.3 to 5.5

V

Output Current (OUTL1, OUTL2, OUTL3, OUTL4, OUTL5, OUTL6, OUTH1, OUTH2, OUTH3, OUTH4,

OUTH5, OUTH6)

(DC) Vds = 12 V

(DC) Vds = 20 V

(DC) Vds = 40 V

(AC) Vds = 12 V, (50 ms pulse, 1 s period)

(AC) Vds = 20 V, (50 ms pulse, 1 s period)

(AC) Vds = 40 V, (50 ms pulse, 1 s period)

−1.5 to 1.5

−0.7 to 0.7

−0.25 to 0.25

−2.0 to 2.0

−0.9 to 0.9

−0.3 to 0.3

A

Electrostatic Discharge, Human Body Model, VS1, VS2, OUTx (Note 1)

4.0

kV

Electrostatic Discharge, Human Body Model, all other pins

2.0

kV

Electrostatic Discharge, Machine Model

200

V

Electrostatic Discharge, Charged Device Model

1.0

kV

Short Circuit Reliability Characterization (AEC−Q10x)

GRADE A

−

Operating Junction Temperature

−40 to 150

°C

Storage Temperature Range

−55 to 150

°C

Moisture Sensitivity Level

SOIC−28

SSOP−24 EPAD

MSL 3

MSL 2

−

Peak Reflow Soldering Temperature: Pb−Free, 60 to 150 seconds at 217

°C (Note 2)

260

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Tested with a VS1/VS2 power supply common point.

2. For additional information, please see or download the ON Semiconductor Soldering and Mounting Techniques Reference Manual,

SOLDERRM/D.

THERMAL CONDITIONS

Thermal Parameters

Test Conditions, Typical Value

Unit

Board Details (Note 3)

Board Details (Note 4)

SOIC−28

Junction−to−Lead (psi−JL8,

10

11

°C/W

78

63

°C/W

SSOP−24 EPAD

−

2

°C/W

−

54

°C/W

−

7

°C/W

″ thick FR4. This is the minimum pad board size.

″ thick FR4.