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VSC7123QU Datasheet(PDF) 17 Page - Vitesse Semiconductor Corporation |
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VSC7123QU Datasheet(HTML) 17 Page - Vitesse Semiconductor Corporation |
17 / 18 page VE LO CIT YT M VITESSE SEMICONDUCTOR CORPORATION VSC7123 10-Bit Transceiver for Fibre Channel and Gigabit Ethernet Data Sheet G52212-0, Rev 4.3 Page 17 03/25//01 © VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012 Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com Internet: www.vitesse.com Package Thermal Considerations The VSC7123 is packaged in a 14mm, thermally-enhanced PQFP with an internal heat spreader a 10 mm, thermally enhanced PQFP and a 10mm cavity-down, exposed pad TQFP. These packages use industry-standard EIAJ footprints, but have been enhanced to improve thermal dissipation. The construction of the packages is shown in Figure 10. Figure 10: PQFP Package Cross Section Table 6: Thermal Resistance The VSC7123 is designed to operate with a case temperature up to 95oC. The user must guarantee that the case temperature specification is not violated. With the thermal resistances shown in Table 7, the 10mm thermally-enhanced PQFP package can operate in still air ambient temperatures of 50oC [50oC = 95oC - 0.9W * 50 C/W]. The 14mm thermally-enhanced PQFP package can operate in still air ambient temperatures of 69oC [69oC = 95oC - 0.9W * 29 C/W]. The TQFP package can operate in a still air ambient temperature of 59oC [59oC = 95oC - 0.9W * 40 C/W]. If the ambient air temperature exceeds these limits, a form of cooling through a heatsink or an increase in airflow must be provided. Moisture Sensitivity Level This device is rated at a Moisture Sensitivity Level 3 rating with maximum floor life of 168 hours at 30ºC, 60% relative humidity. Please refer to Application Note AN-20 for appropriate handling procedures. Symbol Description 10mm PQFP 14mm PQFP 10mm TQFP Units θ jc Thermal resistance from junction-to-case 10 9.5 7.0 oC/W θ ca Thermal resistance from case-to-ambient in still air including conduction through the leads. 50 29 40 oC/W θ ca-100 Thermal resistance from case-to-ambient with 100 LFM airflow 41 26 38 oC/W θ ca-200 Thermal resistance from case-to-ambient with 200 LFM airflow 37 24 35 oC/W θ ca-400 Thermal resistance from case-to-ambient with 400 LFM airflow 32 21 33 oC/W θ ca-600 Thermal resistance from case-to-ambient with 600 LFM airflow 28 18 30 oC/W Internal Heat Spreader Die Plastic Molding Compound Lead Bond Wire Insulator |
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