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9713 Datasheet(PDF) 7 Page - 3M Electronics

Part # 9713
Description  3M??EMI/EMC Electronic Materials
Download  12 Pages
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Manufacturer  3M [3M Electronics]
Direct Link  http://www.3m.com
Logo 3M - 3M Electronics

9713 Datasheet(HTML) 7 Page - 3M Electronics

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9
Contact Resistance
(R ohms) between a
Gold Flexible Test Strip
and a SS panel using
the 3M ECATT
Bond Line EMI
Shielding
(Bond Line
Gap/Slit EMI
Shielding
Potential)
Potential to improve contact R
of a Flex to a PCB grounding locations
via improved surface conformability
and XYZ conductive potential with
an ECATT product type vs. a generic
Z-axis only conductive PSA
Adhesion to
SS type
substrate/3M
TM/24 hour
RT dwell
Ease of Rework
based on a
standard set
of substrates
Thermal Conductivity
(W/mK) or an effective
Thermal Resistance (C/W)
for a given thickness vs a
generic Z-Axis only PSA
Gold flex bonded to SS using
the ECATT. “Best” results
relate to a lower contact R
potential on SS. Contact R can
vary with SS type tested as the
oxide layer thickness on a SS
type affects the final R results.
See note 1.
Best = High dB
EMI Shielding
in
Bond Line
“Gap/Slit”
Contact R between
a Flex and a PCB
Peel Strength
ECATT design
can effect rework
based on acrylic
adhesive type
& conductive
filler type.
Effective Thermal
resistance and
Thermal Conductivity vs a
generic Z-Axis only PSA.
9703
Best
Good
Good
Better
Good
9704
Best
Good
Best
Good
Good
9705
Best
Good
Good
Better
Good
9706
Best
Good
Best
Good
Good
9707
Best
Best
Best
Best
Good
Best
9709
Good
Best
Best
Good
Better
Best
9709S
Best
Best
Best
Good
Better
Best
9709SL
Best
Best
Best
Good
Better
Best
7805
Good
Better
Good
Best
Better
Better
7850
Good
Good
Good
Best
Good
Best
7772
Better
Good
Good
Good
Good
Good
9712
Good
Good
Good
Better
Good
Good
9713
Better
Good
Good
Good
Good
Good
9719
Good
Good
Good
Better
Good
Good
9720S
Better
Good
Good
Good
Good
Good
9723
Better
Good
Better
Best
Good
Good
9750
Best
Best
Best
Best
Good
Good
9732
Best
Better
Better
Best
Good
Good
9760
Best
Better
Better
Good
Best
Good
9764
Better
Better
Good
Good
Best
Good
9780
Better
Better
Good
Good
Best
Good
These long-lasting adhesive transfer tapes can eliminate the need for screws and mechanical
fasteners – while allowing the use of lighter, more compact fabric and layered foil shielding materials.
And, unlike other electrically conductive adhesives that can be messy and difficult to handle, 3M delivers
advanced adhesive and conductive properties in an easy-to-use, pressure-sensitive tape that can be hand
or machine applied and die cut to virtually any shape!
3MElectrically Conductive
Adhesive Transfer Tape (ECATT)
Selection Process
Selection of Grounding, EMI Shielding
and attachment ECATTs consists
of determining several application
requirements: For example, an ECATT
general selection process could take
into consideration items such as, but
not limited to:
1 Determine contact R target
2 Define contact surface type
3 Adhesion level desired - from High-
Medium-Standard Adhesion, and
High/Low adhesion sided ECATTs
4 Bond line thickness
5 Z or XYZ conductive type ECATT
6 Operating temperature range and
environmental conditions
7 EMI Shielding in bond line “Gap/Slit”
for high frequencies
8 Determine contact area for ECATT
used for R and adhesion of surfaces
9 Assembly Pressure, temperature
and time limits
10 After assembly bond line
stresses and need for added
mechanical support


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