MIKROE-2540 datasheet(44/55 Pages) NXP

Part #	MIKROE-2540

Description	High performance full NFC Forum-compliant controller with integrated firmware and NCI interface

Download	55 Pages

Scroll/Zoom	100%

Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

Logo

44 / 55 page

PN7150

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3.3 — 4 July 2016

44 of 55

NXP Semiconductors

PN7150

Full NFC Forum-compliant controller with integrated firmware

16.4 Reflow soldering

Key characteristics in reflow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to

higher minimum peak temperatures (see Figure 32) than a SnPb process, thus

reducing the process window

• Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

• Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classified in accordance with

Table 45 and 46

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 32.

Table 45.

SnPb eutectic process (from J-STD-020D)

Package thickness (mm)

Package reflow temperature (

C)

Volume (mm3)

< 350

 350

< 2.5

235

220

 2.5

220

Table 46.

Lead-free process (from J-STD-020D)

Package thickness (mm)

Package reflow temperature (

C)

Volume (mm3)

< 350

350 to 2000

> 2000

< 1.6

260

1.6 to 2.5

260

250

245

> 2.5

250

245

Similar Part No. - MIKROE-2540

Manufacturer	Part #	Datasheet	Description
List of Unclassifed Man...	MIKROE-2405	289Kb / 1P	schematic v100
List of Unclassifed Man...	MIKROE-2885	362Kb / 2P	PT100 3 wire temperature probe

More results

Similar Description - MIKROE-2540

Manufacturer	Part #	Datasheet	Description
NXP Semiconductors	PN7150B0HN	2Mb / 55P	High performance full NFC Forum-compliant controller with integrated firmware and NCI interface Rev. 3.3-4 July 2016
	PN7220	1Mb / 185P	NFC controller with NCI interface supporting EMV and NFC Forum applications Rev. 3.0 - 5 July 2023
	PN7220	1Mb / 185P	NFC controller with NCI interface supporting EMV and NFC Forum applications Rev. 3.1 - 20 September 2023
	PN7120	537Kb / 58P	NFC controller with integrated firmware, supporting all NFC Forum modes Rev. 3.5-11 June 2018
	OM25180FDKM	3Mb / 149P	High-performance multi-protocol full NFC Forum-compliant frontend Rev. 3.0-7 October 2016
	PN5180A0XX	1Mb / 155P	High-performance multiprotocol full NFC frontend, supporting all NFC Forum modes Rev. 4.1 - 13 March 2023
	PN5180A0XX	1Mb / 160P	High-performance multiprotocol full NFC frontend, supporting all NFC Forum modes
ams AG	AS3955	1Mb / 102P	NFC Forum Compliant Dynamic Tag 2016-Feb-03
	AS3956	1Mb / 107P	NFC Forum Compliant Dynamic Tag 2018-Nov-14
	AS3955	1Mb / 111P	NFC Forum Compliant Dynamic Tag

More results

MIKROE-2540 Datasheet(PDF) 44 Page - NXP Semiconductors

MIKROE-2540 Datasheet(HTML) 44 Page - NXP Semiconductors

Similar Part No. - MIKROE-2540

Similar Description - MIKROE-2540

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55

Datasheet Download

Link URL