www.ti.com

1

2

3

4

8

7

6

5

NC

NC

NC

D, DGN

TOP VIEW

D, DGN

TOP VIEW

NC = No Internal Connection

1

2

3

4

8

7

6

5

REF

PD

NC

NC = No Internal Connection

THS3120

THS3121

Note: The device with the power down option defaults to the ON state if no signal is applied to the PD pin. Additionallly, the REF pin

DISSIPATION RATING TABLE

THS3120, THS3121

SLOS420A – SEPTEMBER 2003 – REVISED NOVEMBER 2003

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling procedures and installation procedures can cause damage.

AVAILABLE OPTIONS

PACKAGED DEVICE

PLASTIC SMALL OUTLINE SOIC (D)

SYMBOL

THS3120CD

THS3120CDGN

0

°C to 70°C

AQA

THS3120CDR

THS3120CDGNR

THS3120ID

THS3120IDGN

-40

°C to 85°C

APN

THS3120IDR

THS3120IDGNR

THS3121CD

THS3121CDGN

0

°C to 70°C

AQO

THS3121CDR

THS3121CDGNR

THS3121ID

THS3121IDGN

-40

°C to 85°C

APO

THS3121IDR

THS3121IDGNR

(1)

Available in tape and reel. The R suffix standard quantity is 2500 (e.g. THS3120CDGNR).

(2)

The PowerPAD is electrically isolated from all other pins.

POWER RATING

PACKAGE

Θ

Θ

38.3

95

1.05 W

421 mW

4.7

58.4

1.71 W

685 W

(1)

This data was taken using the JEDEC standard low-K test PCB. For the JEDEC proposed high-K test PCB, the

Θ

(2)

This data was taken using 2 oz. trace and copper pad that is soldered directly to a 3 inch x 3 inch PCB. For further information, refer to

the Application Information section of this data sheet.

2