NCV898031

www.onsemi.com

3

Rating

Value

Unit

Dc Supply Voltage (VIN)

−0.3 to 40

V

Peak Transient Voltage (Load Dump on VIN)

45

V

Dc Supply Voltage (VDRV, GDRV)

12

V

Peak Transient Voltage (VFB)

−0.3 to 6

V

Dc Voltage (VC, VFB, ISNS)

−0.3 to 3.6

V

Dc Voltage (EN)

−0.3 to 6

V

Dc Voltage Stress (VIN − VDRV)*

−0.7 to 40

V

Operating Junction Temperature

−40 to 150

°C

Storage Temperature Range

−65 to 150

°C

Peak Reflow Soldering Temperature: Pb−Free, 60 to 150 seconds at 217°C

265 peak

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

*An external diode from the input to the VIN pin is required if bootstrapping VDRV and VIN off of the output voltage.

PACKAGE CAPABILITIES

Characteristic

Value

Unit

ESD Capability (All Pins)

Human Body Model

Machine Model

w2.0

w200

KV

V

Moisture Sensitivity Level

1

Package Thermal Resistance

100

°C/W