SN74LVC2G07

DUAL BUFFER/DRIVER

WITH OPENDRAIN OUTPUTS

SCES308E − AUGUST 2001 − REVISED SEPTEMBER 2003

2

POST OFFICE BOX 655303

description/ordering information (continued)

NanoStar

 and NanoFree package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

preventing damaging current backflow through the device when it is powered down.

FUNCTION TABLE

(each buffer/driver)

INPUT

A

OUTPUT

Y

H

H

L

L

logic diagram (positive logic)

1A

1Y

16

2A

2Y

34

−0.5 V to 6.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−0.5 V to 6.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Note 1)

−0.5 V to 6.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Notes 1 and 2)

−0.5 V to 6.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±100 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package thermal impedance,

165

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DCK package

259

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

YEA/YZA package

143

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . .

YEP/YZP package

123

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . .

−65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES:

1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

2. The value of VCC is provided in the recommended operating conditions table.

3. The package thermal impedance is calculated in accordance with JESD 51-7.