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SN74LVC3G14 Datasheet(PDF) 1 Page - Texas Instruments

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Part No. SN74LVC3G14
Description  TRIPLE SCHMITT TRIGGER INVERTER
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
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SN74LVC3G14 Datasheet(HTML) 1 Page - Texas Instruments

 
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SN74LVC3G14
TRIPLE SCHMITT TRIGGER INVERTER
SCES367G − AUGUST 2001 − REVISED SEPTEMBER 2003
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Available in the Texas Instruments
NanoStar
 and NanoFree Packages
D Supports 5-V VCC Operation
D Inputs Accept Voltages to 5.5 V
D Max tpd of 5.4 ns at 3.3 V
D Low Power Consumption, 10-µA Max ICC
D ±24-mA Output Drive at 3.3 V
D Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
D Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
D Ioff Feature Supports Partial-Power-Down
Mode Operation
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
This triple Schmitt-trigger inverter is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC3G14 contains three inverters and performs the Boolean function Y = A. The device functions as
three independent inverters but, because of Schmitt action, it may have different input threshold levels for
positive-going (VT+) and negative-going (VT−) signals.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
NanoStar
 − WCSP (DSBGA)
0.17-mm Small Bump − YEA
SN74LVC3G14YEAR
NanoFree
 − WCSP (DSBGA)
0.17-mm Small Bump − YZA (Pb-free)
Reel of 3000
SN74LVC3G14YZAR
_ _ _CF_
−40
°C to 85°C
NanoStar
 − WCSP (DSBGA)
0.23-mm Large Bump − YEP
Reel of 3000
SN74LVC3G14YEPR
_ _ _CF_
−40
°C to 85°C
NanoFree
 − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
SN74LVC3G14YZPR
SSOP − DCT
Reel of 3000
SN74LVC3G14DCTR
C14_ _ _
VSSOP − DCU
Reel of 3000
SN74LVC3G14DCUR
C14_
VSSOP − DCU
Reel of 250
SN74LVC3G14DCUT
C14_
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡ DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb,
= Pb-free).
Copyright
 2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
DCT OR DCU PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
1A
3Y
2A
GND
VCC
1Y
3A
2Y
4
3
2
1
5
6
7
8
GND
2A
3Y
1A
2Y
3A
1Y
VCC
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.


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