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SN74LVC1G3157DBVR Datasheet(PDF) 1 Page - Texas Instruments |
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SN74LVC1G3157DBVR Datasheet(HTML) 1 Page - Texas Instruments |
1 / 16 page SN74LVC1G3157 SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH SCES424C – JANUARY 2003 - REVISED SEPTEMBER 2003 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D 1.65-V to 5.5-V VCC Operation D Useful for Both Analog and Digital Applications D Specified Break-Before-Make Switching D Rail-to-Rail Signal Handling D High Degree of Linearity D High Speed, Typically 0.5 ns (VCC = 3 V, CL = 50 pF) D Low On-State Resistance, Typically ≈6 Ω (VCC = 4.5 V) D Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II D ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) description/ordering information This single-pole, double-throw (SPDT) analog switch is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC1G3157 can handle both analog and digital signals. The device permits signals with amplitudes of up to VCC (peak) to be transmitted in either direction. Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems. ORDERING INFORMATION TA PACKAGE† ORDERABLE PART NUMBER TOP-SIDE MARKING‡ –40 C to 85 C NanoStar – WCSP (DSBGA) 0.23-mm Large Bump – YEP Tape and reel SN74LVC1G3157YEPR _ _ _C5_ –40 °C to 85°C NanoFree – WCSP (DSBGA) 0.23-mm Large Bump – YZP (Pb-free) Tape and reel SN74LVC1G3157YZPR _ _ _C5_ SOT (SOT-23) – DBV Tape and reel SN74LVC1G3157DBVR CC5_ SOT (SC-70) – DCK Tape and reel SN74LVC1G3157DCKR C5_ † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. ‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Copyright 2003, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. DBV OR DCK PACKAGE (TOP VIEW) 1 2 3 6 5 4 B2 GND B1 S VCC A 3 2 1 4 5 6 B1 GND B2 A VCC S YEP OR YZP PACKAGE (BOTTOM VIEW) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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