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SN74LVC1G3157DBVR Datasheet(PDF) 1 Page - Texas Instruments

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Part # SN74LVC1G3157DBVR
Description  SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

SN74LVC1G3157DBVR Datasheet(HTML) 1 Page - Texas Instruments

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SN74LVC1G3157
SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH
SCES424C – JANUARY 2003 - REVISED SEPTEMBER 2003
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D 1.65-V to 5.5-V VCC Operation
D Useful for Both Analog and Digital
Applications
D Specified Break-Before-Make Switching
D Rail-to-Rail Signal Handling
D High Degree of Linearity
D High Speed, Typically 0.5 ns
(VCC = 3 V, CL = 50 pF)
D Low On-State Resistance, Typically ≈6 Ω
(VCC = 4.5 V)
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
description/ordering information
This single-pole, double-throw (SPDT) analog switch is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G3157 can handle both analog and digital signals. The device permits signals with amplitudes
of up to VCC (peak) to be transmitted in either direction.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for
analog-to-digital and digital-to-analog conversion systems.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
–40 C to 85 C
NanoStar
 – WCSP (DSBGA)
0.23-mm Large Bump – YEP
Tape and reel
SN74LVC1G3157YEPR
_ _ _C5_
–40
°C to 85°C
NanoFree
 – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
Tape and reel
SN74LVC1G3157YZPR
_ _ _C5_
SOT (SOT-23) – DBV
Tape and reel
SN74LVC1G3157DBVR
CC5_
SOT (SC-70) – DCK
Tape and reel
SN74LVC1G3157DCKR
C5_
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following
character
to
designate
the
assembly/test
site.
Pin
1
identifier
indicates
solder-bump
composition
(1 = SnPb,
= Pb-free).
Copyright
 2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
6
5
4
B2
GND
B1
S
VCC
A
3
2
1
4
5
6
B1
GND
B2
A
VCC
S
YEP OR YZP PACKAGE
(BOTTOM VIEW)
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.


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