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GXM Datasheet(PDF) 33 Page - National Semiconductor (TI) |
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GXM Datasheet(HTML) 33 Page - National Semiconductor (TI) |
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33 / 244 page  Revision 3.1 33 www.national.com Signal Definitions (Continued) TMS H1 (PU) N3 (PU) I Test Mode Select JTAG test-mode select. This pin is internally connected to a 20-kohm pull-up resistor. TEST F3 (PD) J5 (PD) I Test Test-mode input. This pin is internally connected to a 20-kohm pull-down resistor. TDP E24 F36 O Thermal Diode Positive TDP is the positive terminal of the thermal diode on the die. The diode is used to do thermal characterization of the device in a system. This signal works in conjunction with TDN. TDN D26 E37 O Thermal Diode Negative TDN is the negative terminal of the thermal diode on the die. The diode is used to do thermal characterization of the device in a system. This signal works in conjunction with TDP. 2.2.6 Internal Test and Measurement Signals Signal Name BGA Pin No. SPGA Pin No. Type Description |
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