NCP3134

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12

Layout Guidelines

When laying out a power PCB for the NCP3134 there are

several key points to consider.

Use four vias to connect the thermal pad to power ground.

Separate the power ground and analog ground planes;

connect them together at a single point.

Increase the thickness of PCB copper, it can help to lower

the die temperature and improve the overall efficiency but

meanwhile increase the cost of the board fabrication.

Use wide traces for the nodes conducting high current

such as VIN, VOUT, PGND and SW.

Place feedback and compensation network components

close to the IC.

Keep FB, COMP away from noisy signals such as SW,

BST.

Place VIN and VDD decoupling capacitors as close to the

IC as possible.

ORDERING INFORMATION

Device

Package

NCP3134MNTXG

QFN16

(Pb−Free)

3000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.