NCP662, NCV662, NCP663, NCV663

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7

APPLICATIONS INFORMATION

A typical application circuit for the NCP662/NCV662

and NCP663/NCV663 series are shown in Figure 1 and

Figure 2.

Input Decoupling (C1)

A 1.0

mF capacitor, either ceramic or tantalum is

recommended and should be connected close to the device

package. Higher capacitance values and lower ESR will

improve the overall line transient response.

TDK capacitor: C2012X5R1C105K or C1608X5R1A105K

Output Decoupling (C2)

The NCP662/NCV662 and NCP663/NCV663 are very

stable regulators and do not require any specific Equivalent

Series Resistance (ESR) or a minimum output current.

Capacitors exhibiting ESRs ranging from a few m

W up to

10

W can safely be used. The minimum decoupling value is

0.1

mF and can be augmented to fulfill stringent load

transient requirements. The regulator accepts ceramic chip

capacitors as well as tantalum devices. Larger values

improve noise rejection and load regulation transient

response.

TDK capacitor: C2012X5R1C105K, C1608X5R1A105K,

or C3216X7R1C105K

Enable Operation (NCP662/NCV662 ONLY)

The enable pin will turn on the regulator when pulled high

and turn off the regulator when pulled low. The threshold

limits are covered in the electrical specification section of

the data sheet. If the enable is not used, the pin should be

Hints

Please be sure the Vin and GND lines are sufficiently

wide. When the impedance of these lines is high, there is a

chance to pick up noise or cause the regulator to

malfunction.

Place external components, especially the output

capacitor, as close as possible to the circuit, and make leads

as short as possible.

Thermal

As

power

across

the

NCP662/NCV662

and

NCP663/NCV663 increases, it might become necessary to

provide some thermal relief. The maximum power

dissipation supported by the device is dependent upon board

design and layout. The mounting pad configuration on the

PCB, the board material, and the ambient temperature effect

the rate of temperature rise for the part. This is stating that

when the devices have good thermal conductivity through

the PCB, the junction temperature will be relatively low with

high power dissipation applications.

The maximum dissipation the package can handle is

given by:

PD +

TJ(max) *TA

RqJA

If junction temperature is not allowed above the

maximum 125C, then the NCP662/NCV662 and

NCP663/NCV663 can dissipate up to 300 mW @ 25C.

The power dissipated by the NCP662/NCV662 and

NCP663/NCV663 can be calculated from the following

equation:

Ptot + Vin *Ignd (Iout) ) [Vin * Vout] *Iout

or

VinMAX +

Ptot ) Vout * Iout

Ignd ) Iout

If an 100 mA output current is needed then the ground

current from the data sheet is 2.5

mA. For the

NCP662/NCV662 or NCP663/NCV663 (3.0 V), the

maximum input voltage is 6.0 V.