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NCP1081 Datasheet(PDF) 6 Page - ON Semiconductor

Part No. NCP1081
Description  Integrated High Power PoE-PD Interface & DC-DC Converter Contr
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Maker  ONSEMI [ON Semiconductor]
Homepage  http://www.onsemi.com
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NCP1081 Datasheet(HTML) 6 Page - ON Semiconductor

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NCP1081
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6
Table 2. ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Min.
Max.
Units
Conditions
VPORTP
Input power supply
−0.3
72
V
Voltage with respect to VPORTN1,2
RTN
ARTN
Analog ground supply 2
−0.3
72
V
Pass−switch in off−state
(Voltage with respect to VPORTN1,2)
VDDH
Internal regulator output
−0.3
17
V
Voltage with respect to ARTN
VDDL
Internal regulator output
−0.3
3.6
V
Voltage with respect to ARTN
CLASS
Analog output
−0.3
3.6
V
Voltage with respect to VPORTN1,2
INRUSH
Analog output
−0.3
3.6
V
Voltage with respect to VPORTN1,2
ILIM1
Analog output
−0.3
3.6
V
Voltage with respect to VPORTN1,2
UVLO
Analog input
−0.3
3.6
V
Voltage with respect to VPORTN1,2
OSC
Analog output
−0.3
3.6
V
Voltage with respect to ARTN
COMP
Analog input / output
−0.3
3.6
V
Voltage with respect to ARTN
FB
Analog input
−0.3
3.6
V
Voltage with respect to ARTN
CS
Analog input
−0.3
3.6
V
Voltage with respect to ARTN
SS
Analog input
−0.3
3.6
V
Voltage with respect to ARTN
nCLASS_AT
Analog output
−0.3
3.6
V
Voltage with respect to ARTN
TEST1
TEST2
Digital inputs
−0.3
3.6
V
Voltage with respect to VPORTN1,2
Ta
Ambient temperature
−40
85
°C
Tj
Junction temperature
150
°C
Tj−TSD
Junction temperature (Note 1)
175
°C
Thermal shutdown condition
Tstg
Storage Temperature
−55
150
°C
TθJA
Thermal Resistance,
Junction to Air (Note 2)
37.6
°C/W
Exposed pad connected to VPORTN1,2 ground
ESD−HBM
Human Body Model
4
kV
per JEDEC Standard JESD22
ESD−CDM
Charged Device Model
750
V
ESD−MM
Machine Model
300
V
LU
Latch−up
±200
mA
per JEDEC Standard JESD78
ESD−SYS
System ESD (contact/air) (Note 3)
8/15
kV
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Tj−TSD allowed during error conditions only. It is assumed that this maximum temperature condition does not occur more than 1 hour
cumulative during the useful life for reliability reasons.
2. Mounted on a 1S2P (3 layer) test board with copper coverage of 25 percent for the signal layers and 90 percent copper coverage for the
inner planes at an ambient temperature of 85°C in still air. Refer to JEDEC JESD51−7 for details.
3. Surges per EN61000−4−2, 1999 applied between RJ−45 and output ground and between adapter input and output ground of the evaluation
board. The specified values are the test levels and not the failure levels.


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