If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Supply Voltage (V

−0.3V to +4V

Input Voltage (R

−0.3V to 3.9V

Enable Input Voltage (EN, EN*)

−0.3V to (V

Output Voltage (R

−0.3V to (V

Maximum Package Power Dissipation +25˚C

M Package

1025 mW

MTC Package

866 mW

Derate M Package

8.2 mW/˚C above +25˚C

Derate MTC Package

6.9 mW/˚C above +25˚C

Storage Temperature Range

−65˚C to +150˚C

Lead Temperature Range Soldering

(4 sec.)

+260˚C

Maximum Junction Temperature

+150˚C

ESD Rating (Note 10)

(HBM, 1.5 k

Ω, 100 pF)

≥ 10 kV

(EIAJ, 0

Ω, 200 pF)

≥ 1200 V

Recommended Operating

Conditions

Min

Typ

Max

Units

Supply Voltage (V

+3.0

+3.3

+3.6

V

Receiver Input Voltage

GND

+3.0

V

Operating Free Air

Temperature (T

−40

25

+85

˚C

Electrical Characteristics

Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (Notes 2, 3)

Symbol

Parameter

Conditions

Pin

Min

Typ

Max

Units

V

TH

Differential Input High Threshold

V

R

+100

mV

V

TL

Differential Input Low Threshold

R

IN−

−100

mV

VCMR

Common-Mode Voltage Range

VID = 200mV pk to pk (Note 5)

0.1

2.3

V

I

IN

Input Current

V

V

−10

+10

µA

V

−10

+10

µA

V

V

-20

+20

µA

V

OH

Output High Voltage

I

R

OUT

2.7

3.3

V

I

2.7

3.3

V

I

2.7

3.3

V

V

OL

Output Low Voltage

I

0.05

0.25

V

I

OS

Output Short Circuit Current

Enabled, V

−15

−47

−100

mA

I

OZ

Output TRI-STATE Current

Disabled, V

−10

+10

µA

V

IH

Input High Voltage

EN,

EN*

2.0

V

CC

V

V

IL

Input Low Voltage

GND

0.8

V

I

I

Input Current

V

GND

−10

+10

µA

V

CL

Input Clamp Voltage

I

−1.5

−0.8

V

I

CC

No Load Supply Current

Receivers Enabled

EN = V

V

CC

915

mA

I

CCZ

No Load Supply Current

EN = GND, Inputs Open

1

5

mA

Receivers Disabled

Switching Characteristics

Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (Notes 3, 4, 7, 8)

Symbol

Parameter

Conditions

Min

Typ

Max

Units

t

PHLD

Differential Propagation Delay High to Low

C

1.2

2.0

2.7

ns

t

PLHD

Differential Propagation Delay Low to High

V

1.2

1.9

2.7

ns

t

SKD1

Differential Pulse Skew |t

(

Figure 1 and Figure 2)

0

0.1

0.4

ns

t

SKD2

Differential Channel-to-Channel Skew; same device

(Note 7)

0

0.15

0.5

ns

t

SKD3

Differential Part to Part Skew (Note 8)

1.0

ns

t

SKD4

Differential Part to Part Skew (Note 9)

1.5

ns

t

TLH

Rise Time

0.5

1.0

ns

t

THL

Fall Time

0.35

1.0

ns

www.national.com

2