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MC78L08ACPG Datasheet(PDF) 2 Page - ON Semiconductor

Part No. MC78L08ACPG
Description  100 mA Positive Voltage Regulators
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Maker  ONSEMI [ON Semiconductor]
Homepage  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MC78L08ACPG Datasheet(HTML) 2 Page - ON Semiconductor

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MC78L00A Series, NCV78L00A
www.onsemi.com
2
Figure 2. Standard Application
A common ground is required between the input and the output voltages. The input voltage must remain typically 2.0 V above the output
voltage even during the low point on the input ripple voltage.
* Cin is required if regulator is located an appreciable distance from power supply filter.
** CO is not needed for stability; however, it does improve transient response.
MC78LXXA
Input
Cin*
0.33
mF
CO**
0.1
mF
Output
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage (5.0 V−9.0 V)
Input Voltage (12 V−18 V)
Input Voltage (24 V)
VI
30
35
40
Vdc
Storage Temperature Range
Tstg
−65 to +150
°C
Maximum Junction Temperature
TJ
150
°C
Moisture Sensitivity Level
MSL
1
ESD Capability, Human Body Model (Note 1)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 1)
ESDMM
200
V
ESD Capability, Charged Device Model (Note 1)
ESDCDM
2000
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
ESD Charged Device Model tested per EIA/JES D22/C101, Field Induced Charge Model.
THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Package Dissipation
PD
Internally Limited
W
Thermal Characteristics, TO−92
Thermal Resistance, Junction−to−Ambient
RqJA
200
°C/W
Thermal Characteristics, SOIC8
Thermal Resistance, Junction−to−Ambient
RqJA
Refer to Figure 8
°C/W
Thermal Characteristics, SOT−89
Thermal Resistance, Junction−to−Ambient
RqJA
55
°C/W
2. Thermal Resistance, Junction−to−Ambient depends on P.C.B. Copper area. See details in Figure 8.
Thermal Resistance, Junction−to−Case is not defined. SOIC 8 lead and TO-92 packages that do not have a heat sink like other packages
may have. This is the reason that a Theta JC is never specified. A little heat transfer will occur through the package but since it is plastic, it is
minimal. The majority of the heat that is transferred is through the leads where they connect to the circuit board.


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