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UCC27424P Datasheet(PDF) 2 Page - Texas Instruments |
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UCC27424P Datasheet(HTML) 2 Page - Texas Instruments |
2 / 24 page UCC27423, UCC27424, UCC27425 SLUS545B − NOVEMBER 2002 − REVISED NOVEMBER 2004 2 www.ti.com ORDERING INFORMATION OUTPUT TEMPERATURE RANGE PACKAGED DEVICES OUTPUT CONFIGURATION TEMPERATURE RANGE TA = TJ SOIC-8 (D) MSOP-8 PowerPAD (DGN) } PDIP-8 (P) Dual inverting −40 °C to +105°C UCC27423D UCC27423DGN UCC27423P Dual nonInverting −40 °C to +105°C UCC27424D UCC27424DGN UCC27424P One inverting, one noninverting −40 °C to +105°C UCC27425D UCC27425DGN UCC27425P † D (SOIC−8) and DGN (PowerPAD−MSOP) packages are available taped and reeled. Add R suffix to device type (e.g. UCC27423DR, UCC27424DGNR) to order quantities of 2,500 devices per reel for D or 1,000 devices per reel for DGN package. ‡ The PowerPAD is not directly connected to any leads of the package. However, it is electrically and thermally connected to the substrate which is the ground of the device. D, DGN, OR P PACKAGE (TOP VIEW) D, DGN, OR P PACKAGE (TOP VIEW) D, DGN, OR P PACKAGE (TOP VIEW) ENBA INA GND INB ENBB OUTA VDD OUTB 8 7 6 5 1 2 3 4 ENBA INA GND INB ENBB OUTA VDD OUTB 8 7 6 5 1 2 3 4 ENBA INA GND INB ENBB OUTA VDD OUTB 8 7 6 5 1 2 3 4 (DUAL INVERTING) (DUAL NON−INVERTING) (ONE INVERTING AND ONE NON−INVERTING) UCC27423 UCC27424 UCC27425 power dissipation rating table PACKAGE SUFFIX Θjc (°C/W) Θja (°C/W) Power Rating (mW) TA = 70°C See Note 1 Derating Factor Above 70 °C (mW/5C) See Note 1 SOIC-8 D 42 84 – 160 } 344−655 See Note 2 6.25 − 11.9 See Note 2 PDIP-8 P 49 110 500 9 MSOP PowerPAD-8 See Note 3 DGN 4.7 50 − 59 } 1370 17.1 Notes: 1. 125 °C operating junction temperature is used for power rating calculations 2. The range of values indicates the effect of pc−board. These values are intended to give the system designer an indication of the best and worst case conditions. In general, the system designer should attempt to use larger traces on the pc−board where possible in order to spread the heat away form the device more effectively. For information on the PowerPAD t package, refer to Technical Brief, PowerPad Thermally Enhanced Package, Texas Instrument s Literature No. SLMA002 and Application Brief, PowerPad Made Easy, Texas Instruments Literature No. SLMA004. 3. The PowerPAD is not directly connected to any leads of the package. However, it is electrically and thermally connected to the substrate which is the ground of the device. Table 1. Input/Output Table INPUTS (VIN_L, VIN_H) UCC27423 UCC27424 UCC27425 ENBA ENBB INA INB OUTA OUTB OUTA OUTB OUTA OUTB H H L L H H L L H L H H L H H L L H H H H H H L L H H L L L H H H H L L H H L H L L X X L L L L L L |
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