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NCP508MT18TBG Datasheet(PDF) 11 Page - ON Semiconductor |
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NCP508MT18TBG Datasheet(HTML) 11 Page - ON Semiconductor |
11 / 15 page NCP508 http://onsemi.com 11 Cin = Cout = 1 mF Vin = VEN = 2.8 V Vout = 2.5 V TA = 25°C Ilimit = 180 mA Figure 32. Hard Short−Circuit Current (by Copper Wires) 500 ms/div 50 mA/div 0 0.01 0.02 0.03 0.04 0.05 0.06 0 1 2 3 4 5 6 7 8 9 10 11 12 13 Figure 33. Measured Power Operating Area, 1.5 V, TA = 855C, Vout_drop = max 0.1 V Vin, INPUT VOLTAGE (V) 33 x 26 mm Figure 34. Evaluation Board 0 50 100 150 200 250 300 350 0 100 200 300 400 500 600 700 800 900 1000 0 0.05 0.1 0.15 0.2 0.25 COPPER HEAT SPREADER AREA (mm2) PD qJA Figure 35. SC70−5 Thermal Resistance vs. Copper Heat Spreader Area VEN = Vin Cin = Cout = 1 mF TA = 85°C PCB Copper Thickness = 1.0 oz 50 100 150 200 250 300 400 0 100 200 300 400 500 600 700 800 900 PCB COPPER HEAT SPREADER AREA (mm2) Figure 36. WDFN6 Thermal Resistance vs. Copper Heat Spreader Area 350 PCB Copper Thickness = 1.0 oz |
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