THS3061

THS3062

SLOS394A – JULY 2002 – OCTOBER 2002

www.ti.com

2

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted(1)

UNIT

16.5 V

S

200 mA

±3 V

Continuous power dissipation

See Dissipation Rating Table

150

°C

–40

°C to 85°C

–65

°C to 150°C

Lead temperature

1,6 mm (1/16 inch) from case for 10 seconds

300

°C

Exposure to absolute maximum conditions for extended periods

may degrade device reliability. These are stress ratings only, and

functional operation of the device at these or any other conditions

beyond those specified is not implied.

the chip. This acts as a heatsink and must be connected to a

thermally dissipative plane for proper power dissipation. Failure

to do so may result in exceeding the maximum junction

temperature which could permanently damage the device. See TI

technical brief SLMA002 for more information about utilizing the

PowerPAD thermally enhanced package.

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be

handled with appropriate precautions. Failure to observe

proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

PACKAGE DISSIPATION RATINGS

PACKAGE

θJC

(

°C/W)

θJA

(

°C/W)

POWER RATING

(TJ = 125°C)

PACKAGE

(

°C/W)

(

°C/W)

TA ≤ 25°C

TA = 85°C

D(8 pin)(1)

38.3

95

1.05 W

0.42 W

DDA (8 pin)

9.2

45.8

2.18 W

0.87 W

DGN (8 pin)(2)

4.7

58.4

1.71 W

0.68 W

(1) This data was taken using the JEDEC High-K test PCB. For the

JEDEC Low-K test PCB,

θJA is 167°C/W with power rating at

TA = 25°C of 0.6 W.

(2) This data was taken using 2 oz. trace and copper pad that is

soldered directly to a 3 in. x 3 in. PCB.

RECOMMENDED OPERATING CONDITIONS

MIN

MAX

UNIT

Supply voltage

Dual supply

±5

±15

V

Supply voltage

Single supply

10

30

V

–40

85

°C

PACKAGE/ORDERING INFORMATION

NUMBER OF CHANNELS

ORDERABLE PACKAGE AND NUMBER

(OPERATING RANGE FROM –40

°C TO 85°C)

NUMBER OF CHANNELS

PLASTIC SOIC-8(1)

(D)

PLASTIC SOIC-8(1)

PowerPAD (DDA)

PLASTIC MSOP-8(1)

PowerPAD (DGN)

PACKAGE MARKING

1

THS3061D

—

THS3061DGN

BIB

2

THS3062D

THS3062DDA

THS3062DGN

BIC

(1) This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., THS3062DGNR).

PIN ASSIGNMENTS

NC – No internal connection

1

2

3

4

8

7

6

5

NC

NC

NC

1

2

3

4

8

7

6

5

THS3062

D, DDA, DGN

THS3061

D, DGN

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