NCV8154

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2

Figure 2. Simplified Schematic Block Diagram

IN2*

OUT2

ACTIVE

DISCHARGE

THERMAL

SHUTDOWN

ENABLE

LOGIC

GND

EN2

EN2

BANDGAP

REFERENCE

MOSFET

DRIVER WITH

CURRENT LIMIT

THERMAL

SHUTDOWN

MOSFET

DRIVER WITH

CURRENT LIMIT

ACTIVE

DISCHARGE

EN1

BANDGAP

REFERENCE

ENABLE

LOGIC

EN1

OUT1

IN1*

GND

*Dual IN available only for DFN10

Table 1. PIN FUNCTION DESCRIPTION − DFN10

Pin No.

Pin Name

Description

1

GND

Power supply ground. Soldered to the copper plane allows for effective heat dissipation.

2

OUT1

Regulated output voltage of the first channel. A small 1

mF ceramic capacitor is needed from this pin to

ground to assure stability.

3

OUT2

Regulated output voltage of the second channel. A small 1

mF ceramic capacitor is needed from this pin to

ground to assure stability.

4

GND

Power supply ground. Soldered to the copper plane allows for effective heat dissipation.

5,6

N/C

Not connected, can be tied to ground plane to improve thermal dissipation.

7

EN2

Driving EN2 over 0.9 V turns-on OUT2. Driving EN below 0.4 V turns-off the OUT2 and activates the active

discharge.

8

IN2

Inputs pin for second channel. It is recommended to connect 1

mF ceramic capacitor close to the device pin.

9

IN1

Inputs pin for first channel. It is recommended to connect 1

mF ceramic capacitor close to the device pin.

10

EN1

Driving EN1 over 0.9 V turns-on OUT1. Driving EN below 0.4 V turns-off the OUT1 and activates the active

discharge.

−

EXP

Exposed pad must be tied to ground. Soldered to the copper plane allows for effective thermal dissipation.