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NCV8570BMN250R2G Datasheet(PDF) 2 Page - ON Semiconductor |
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NCV8570BMN250R2G Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 20 page NCV8570B http://onsemi.com 2 RPD RDIS Figure 2. Simplified Block Diagram PIN FUNCTION DESCRIPTION Pin No. DFN6 Pin No. TSOP−5 Pin Name Description 1 3 EN Enable pin: This pin allows on/off control of the regulator. To disable the device, connect to GND. If this function is not in use, connect to Vin. Internal 5 MW Pull Down resistor is connected between EN and GND. 2, 5, EPAD 2 GND Power Supply Ground (Pins are fused for the DFN6 package). Pins 2, 5 and EPAD are connected together through the lead frame in the DFN6 package. 3 1 IN Power Supply Input Voltage 4 5 OUT Regulated Output Voltage 6 4 BYP Noise reduction pin. (Connect 10 nF or 100 nF capacitor to GND) MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (Note 2) IN −0.3 V to 6 V V Chip Enable Voltage EN −0.3 V to VIN +0.3 V Noise Reduction Voltage BYP −0.3 V to VIN +0.3 V V Output Voltage OUT −0.3 V to VIN +0.3 V V Output Short−Circuit Duration Infinity Maximum Junction Temperature TJ(max) 125 C Storage Temperature Range TSTG −55 to 150 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V tested per MIL−STD−883, Method 3015 Machine Model Method 200 V This device meets or exceeds AEC−Q100 standard. THERMAL CHARACTERISTICS Rating Symbol Value Unit Package Thermal Resistance, DFN6: (Notes 2, 3) Junction−to−Case (Pin 2) Junction−to−Ambient YJL2 RqJA 38 110 C /W Package Thermal Resistance, TSOP−5: (Notes 2, 3) Junction−to−Case (Pin 2) Junction−to−Ambient YJL2 RqJA 92 204 C /W 2. Refer to APPLICATION INFORMATION for Safe Operating Area 3. Single component mounted on 1 oz, FR4 PCB with 645mm2 Cu area. |
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