2004 Jan 27

28

Philips Semiconductors

Preliminary specification

High efficiency 2

× 25 W/4 Ω

stereo car radio power amplifier

TDA1564

8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not

suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

10. Hot bar or manual soldering is suitable for PMFP packages.

11. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted

on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar

soldering process. The appropriate soldering profile can be provided on request.