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NCP114AMX310TCG Datasheet(PDF) 2 Page - ON Semiconductor

Part # NCP114AMX310TCG
Description  300 mA CMOS Low Dropout Regulator
Download  17 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCP114AMX310TCG Datasheet(HTML) 2 Page - ON Semiconductor

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NCP114
www.onsemi.com
2
IN
OUT
BANDGAP
REFERENCE
ACTIVE
DISCHARGE*
MOSFET
DRIVER WITH
CURRENT LIMIT
THERMAL
SHUTDOWN
ENABLE
LOGIC
GND
AUTO LOW
POWER MODE
EN
EN
Figure 2. Simplified Schematic Block Diagram
*Active output discharge function is present only in NCP114AMXyyyTCG devices.
yyy denotes the particular VOUT option.
PIN FUNCTION DESCRIPTION
Pin No.
(UDFN4)
Pin No.
(TSOP5)
Pin Name
Description
1
5
OUT
Regulated output voltage pin. A small ceramic capacitor with minimum value of 1
mF is need-
ed from this pin to ground to assure stability.
2
2
GND
Power supply ground.
3
3
EN
Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into
shutdown mode.
4
1
IN
Input pin. A small capacitor is needed from this pin to ground to assure stability.
4
N/C
Not connected. This pin can be tied to ground to improve thermal dissipation.
EPAD
Exposed pad should be connected directly to the GND pin. Soldered to a large ground cop-
per plane allows for effective heat removal.
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage (Note 1)
VIN
−0.3 V to 6 V
V
Output Voltage
VOUT
−0.3 V to VIN + 0.3 V or 6 V
V
Enable Input
VEN
−0.3 V to VIN + 0.3 V or 6 V
V
Output Short Circuit Duration
tSC
s
Maximum Junction Temperature
TJ(MAX)
150
°C
Storage Temperature
TSTG
−55 to 150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114,
ESD Machine Model tested per EIA/JESD22−A115,
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS (Note 3)
Rating
Symbol
Value
Unit
Thermal Characteristics, UDFN4 1x1 mm
Thermal Resistance, Junction−to−Air
RqJA
170
°C/W
Thermal Characteristics, TSOP−5
Thermal Resistance, Junction−to−Air
RqJA
236
°C/W
3. Single component mounted on 1 oz, FR 4 PCB with 645 mm2 Cu area.


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