OPA1632

SBOS286 − DECEMBER 2003

www.ti.com

9

POWER DISSIPATION AND THERMAL

CONSIDERATIONS

The OPA1632 does not have thermal shutdown

protection. Take care to assure that the maximum

junction temperature is not exceeded. Excessive

junction temperature can degrade performance or

cause permanent damage. For best performance and

reliability, assure that the junction temperature does not

exceed 125

°C.

The thermal characteristics of the device are dictated

by the package and the circuit board. Maximum power

dissipation for a given package can be calculated using

the following formula:

P

Dmax

+

* T

A

q

JA

Where:

amplifier (W).

is

the

absolute

maximum

junction

temperature (

_C).

junctions to the case (

_C/W).

ambient air (

_C/W).

For systems where heat dissipation is more critical, the

OPA1632 is offered in an MSOP-8 with PowerPAD.

The thermal coefficient for the MSOP PowerPAD

(DGN) package is substantially improved over the

traditional SO package. Maximum power dissipation

levels are depicted in Figure 5 for the two packages.

The data for the DGN package assumes a board layout

that follows the PowerPAD layout guidelines.

MAXIMUM POWER DISSIPATION

vs AMBIENT TEMPERATURE

−40

−15

10

85

60

35

Ambient Temperature (

_C)

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0

θ

θ

T

No Airflow

SO−8 (D) Package

MSOP−8 (DGN) Package

Figure 5. Maximum Power Dissipation vs Ambient

Temperature

(1)