PowerDI is a registered trademark of Diodes Incorporated.

DMNH6042SPS

Document number: DS38683 Rev. 1 - 2

2 of 7

www.diodes.com

July 2016

© Diodes Incorporated

DMNH6042SPS

Characteristic

Symbol

Value

Unit

Drain-Source Voltage

60

V

Gate-Source Voltage

±20

V

Steady

State

24

17

A

Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)

35

A

Maximum Continuous Body Diode Forward Current (Note 7)

24

A

Avalanche Current (Note 8) L = 10mH

3.5

A

Avalanche Energy (Note 8) L = 10mH

65

mJ

Characteristic

Symbol

Value

Unit

Total Power Dissipation (Note 5)

1.5

W

Thermal Resistance, Junction to Ambient (Note 5)

Steady state

98

°C/W

t<10s

54

Total Power Dissipation (Note 6)

2.9

W

Thermal Resistance, Junction to Ambient (Note 6)

Steady state

51

°C/W

t<10s

26

Thermal Resistance, Junction to Case (Note 7)

3.5

Operating and Storage Temperature Range

-55 to +175

°C

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 9)

Drain-Source Breakdown Voltage

60

—

—

V

—

—

1

µA

Gate-Source Leakage

—

—

±100

nA

ON CHARACTERISTICS (Note 9)

Gate Threshold Voltage

1.0

—

3.0

V

Static Drain-Source On-Resistance

—

34

50

m

Ω

—

45

65

Diode Forward Voltage

—

0.8

1.2

V

DYNAMIC CHARACTERISTICS (Note 10)

Input Capacitance

—

584

—

pF

f = 1.0MHz

Output Capacitance

—

83

—

pF

Reverse Transfer Capacitance

—

24

—

pF

Gate Resistance

—

3.8

—

Ω

—

4.2

—

nC

—

8.8

—

nC

Gate-Source Charge

—

1.8

—

nC

Gate-Drain Charge

—

1.8

—

nC

Turn-On Delay Time

—

3.4

—

ns

Turn-On Rise Time

—

1.9

—

ns

Turn-Off Delay Time

—

10.1

—

ns

Turn-Off Fall Time

—

4.5

—

ns

Body Diode Reverse Recovery Time

—



12.9

—



ns

Body Diode Reverse Recovery Charge

—



5.4

—



nC

Notes:

5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.

6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.

7. Thermal resistance from junction to soldering point (on the exposed drain pad).

9. Short duration pulse test used to minimize self-heating effect.

10. Guaranteed by design. Not subject to product testing.