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MC33997 Datasheet(PDF) 5 Page - Motorola, Inc

Part No. MC33997
Description  Switching Power Supply with Linear Regulators
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Manufacturer  MOTOROLA [Motorola, Inc]
Direct Link  http://www.freescale.com
Logo MOTOROLA - Motorola, Inc

MC33997 Datasheet(HTML) 5 Page - Motorola, Inc

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MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
33997
5
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
Main Supply Voltage
VPWR
-0.3 to 45
V
Keep-Alive Supply Voltage
KA_VPWR
-0.3 to 45
V
Switching Node
VSW
-0.5 to 45
V
5.0 V Input Power
VDDH
-0.3 to 6.0
V
Sensor Supply
VREF1
VREF2
-0.3 to 18
-0.3 to 18
V
Keep-Alive Supply Voltage
VKAM
-0.3 to 6.0
V
Maximum Voltage at Logic I/O Pins
EN
SNSEN
PWROK
VKAMOK
-0.3 to 6.0
-0.3 to 6.0
-0.3 to 6.0
-0.3 to 6.0
V
Charge Pump Reservoir Capacitor Voltage
CRES
-0.3 to 18
V
Error Amplifier Summing Node
VSUM
-0.3 to 6.0
V
Switching Regulator Output Feedback
FBKB
-0.3 to 6.0
V
VDDL Base Drive
DRVL
-0.3 to 6.0
V
VDDL Feedback
FBL
-0.3 to 6.0
V
ESD Voltage
Human Body Model (all pins) (Note 1)
Machine Model (all pins) (Note 2)
VESD1
VESD2
±500
±100
V
Power Dissipation (TA = 25°C) (Note 3)
PD
800
mW
Thermal Resistance, Junction to Ambient (Note 4), (Note 5)
RθJ-A
60
°C/W
Thermal Resistance, Junction to Board (Note 6)
RθJ-B
20
°C/W
Operational Package Temperature [Ambient Temperature] (Note 7)
TA
-40 to 125
°C
Operational Junction Temperature
TJ
-40 to 150
°C
Storage Temperature
TSTG
-55 to 150
°C
Lead Soldering Temperature (Note 8)
TS
260
°C
Notes
1.
ESD1 testing is performed in accordance with the Human Body Model (CZAP=100 pF, RZAP=1500 Ω).
2.
ESD2 testing is performed in accordance with the Machine Model (CZAP=200 pF, RZAP=0 Ω)
3.
Maximum power dissipation at indicated junction temperature.
4.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
5.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
6.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface
of the board near the package.
7.
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
8.
Lead soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com


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