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TPS61300 Datasheet(PDF) 5 Page - Texas Instruments |
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TPS61300 Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 70 page  5 TPS61300, TPS61301 TPS61305, TPS61305A, TPS61306 www.ti.com SLVS957E – JUNE 2009 – REVISED APRIL 2016 Product Folder Links: TPS61300 TPS61301 TPS61305 Submit Documentation Feedback Copyright © 2009–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. (3) In applications where high power dissipation or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature [TA(MAX)] is dependent on the maximum operating junction temperature [TJ(MAX)], the maximum power dissipation of the device in the application [PD(MAX)], and the junction-to-ambient thermal resistance of the part and package in the application ( θJA), as given by the following equation: TA(MAX) = TJ(MAX) – (θJA × PD(MAX)) 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Voltage range(2) AVIN, VOUT, SW, LED1, LED2, LED3, SCL, SDA, FLASH_SYNC, ENDCL, NRESET, ENVM, GPIO/PG, HC_SEL, Tx-MASK, TS, BAL –0.3 7 V Current on GPIO/PG ±25 mA Power dissipation Internally limited Operating ambient temperature(3), TA –40 85 °C Maxium operating junction temperature, TJ(MAX) 150 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT TJ Operating junction temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 7.4 Thermal Information THERMAL METRIC(1) TPS6130xx UNIT YFF (DSBGA) 20 PINS RθJA Junction-to-ambient thermal resistance 70.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 0.4 °C/W RθJB Junction-to-board thermal resistance 11.4 °C/W ψJT Junction-to-top characterization parameter 1.9 °C/W ψJB Junction-to-board characterization parameter 11.2 °C/W |
Similar Part No. - TPS61300_16 |
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Similar Description - TPS61300_16 |
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