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TPS61260DRVR Datasheet(PDF) 4 Page - Texas Instruments |
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TPS61260DRVR Datasheet(HTML) 4 Page - Texas Instruments |
4 / 26 page TPS61260, TPS61261 SLVSA99B – MAY 2011 – REVISED NOVEMBER 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VIN, L, VOUT, EN, FB –0.3 5.0 V Voltage range(2) RI –0.3 3.6 V Operating junction temperature range, TJ –40 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network ground terminal. 6.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all 2 kV pins(2) VESD Electrostatic discharge(1) Charged device model (CDM), per JEDEC specification JESD22- 0.5 kV C101, all pins(3) (1) ESD testing is performed according to the respective JESD22 JEDEC standard. (2) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Input supply voltage at VIN 0.8 4.0 V Operating free air temperature range, TA –40 85 °C Operating junction temperature range, TJ –40 125 °C 6.4 Thermal Information TPS61260, TPS61261 THERMAL METRIC(1) UNIT DRV (6 PINS) RθJA Junction-to-ambient thermal resistance 89 RθJC(top) Junction-to-case (top) thermal resistance 100 RθJB Junction-to-board thermal resistance 35 °C/W ψJT Junction-to-top characterization parameter 2 ψJB Junction-to-board characterization parameter 36 RθJC(bot) Junction-to-case (bottom) thermal resistance 8 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2011–2014, Texas Instruments Incorporated Product Folder Links: TPS61260 TPS61261 |
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