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LMS485 Datasheet(PDF) 5 Page - National Semiconductor (TI) |
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LMS485 Datasheet(HTML) 5 Page - National Semiconductor (TI) |
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Electrical Characteristics (Continued) Over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) Symbol Parameter Conditions Min Typ Max Units V OH CMOS High-level Output Voltage I OH = −4mA, VID = 200mV 3.5 V V OL CMOS Low-level I OL = 4mA, VID = −200mV 0.40 V I OZR Tristate Output Leakage Current 0.4V ≤ V O ≤ + 2.4V ±1µA R IN Input Resistance − 7V ≤ V CM ≤+12V 12 k Ω Power Supply Current I CC Supply Current DE = V CC, RE = GND or VCC 320 500 µA DE = 0V, RE = GND or V CC 315 400 I OSD1 Driver Short-circuit Output Current V O = high, −7V ≤ V CM ≤ + 12V (Note 8) 35 250 mA I OSD2 Driver Short-circuit Output Current V O = low, − 7V ≤V CM ≤ + 12V (Note 8) 35 250 mA I OSR Receiver Short-circuit Output Current 0V ≤V O ≤ V CC 795 mA Switching Characteristics Driver T PLH, T PHL Propagation Delay Input to Output R L =54 Ω,C L = 100pF (Figure 3, Figure 7) 10 35 60 nS T SKEW Driver Output Skew R L =54 Ω,C L = 100 pF (Figure 3, Figure 7) 510 nS T R, T F Driver Rise and Fall Time R L =54 Ω,C L = 100 pF (Figure 3, Figure 7) 3 8 40 nS T ZH, T ZL Driver Enable to Ouput Valid Time C L = 100 pF, RL = 500 Ω (Figure 4, Figure 8) 25 70 nS T HZ, T LZ Driver Output Disable Time C L = 15 pF, RL = 500 Ω (Figure 4, Figure 8) 30 70 nS Receiver T PLH, T PHL Propagation Delay Input to Output R L =54 Ω,C L = 100 pF (Figure 5, Figure 7) 20 50 200 nS T SKEW Receiver Output Skew R L =54 Ω,C L = 100 pF (Figure 5, Figure 7) 5nS T ZH, T ZL Receiver Enable Time C L = 15 pF, RL =1 k Ω (Figure 6, Figure 10) 20 50 nS Receiver Disable Time 20 50 nS F MAX Maximum Data Rate 2.5 Mbps Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics Note 2: All voltage values, except differential I/O bus voltage, are with respect to network ground terminal. Note 3: The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) -TA)/θJA. All numbers apply for packages soldered directly into a PC board. Note 4: ESD rating based upon human body model, 100pF discharged through 1.5k Ω. Note 5: Voltage limits apply to DI, DE, RE pins. Note 6: Differential input/output bus voltage is measured at the non-inverting terminal A with respect to the inverting terminal B. Note 7: | ∆VOD| and |∆VOC| are changes in magnitude of VOD and VOC, respectively when the input changes from high to low levels. Note 8: Peak current www.national.com 5 |
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