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TPS62623YFDR Datasheet(PDF) 4 Page - Texas Instruments |
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TPS62623YFDR Datasheet(HTML) 4 Page - Texas Instruments |
4 / 28 page TPS62620, TPS62621, TPS62622 TPS62623, TPS62624, TPS62625 SLVS848D – JULY 2009 – REVISED OCTOBER 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Voltage at VIN, SW(2) –0.3 7 VIN Voltage at FB(2) -0.3 3.6 V Voltage at EN, MODE (2) -0.3 VIN + 0.3 Power dissipation Internally limited TA Operating temperature range(3) -40 85 °C TJ (max) Maximum operating junction temperature 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. (3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA(max) = TJ(max) – (θJA x PD(max)). To achieve optimum performance, it is recommended to operate the device with a maximum junction temperature of 105°C. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all ±2000 pins(1) V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification ±1000 JESD22-C101, all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. The human body model is a 100-pF capacitor discharged through a 1.5-k Ω resistor into each pin. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted) MIN TYP MAX UNIT Supply voltage, VIN 2.3 5.5 V Operating free air temperature, TA –40 85 °C Operating junction temperature, TJ 150 °C 7.4 Thermal Information TPS626x THERMAL METRIC(1) YFF/YFD (DSBGA) UNIT 6 PINS RθJA Junction-to-ambient thermal resistance 130 °C/W RθJC(top) Junction-to-case (top) thermal resistance 1.2 °C/W RθJB Junction-to-board thermal resistance 22 °C/W ψJT Junction-to-top characterization parameter 5.0 °C/W ψJB Junction-to-board characterization parameter 22.0 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated |
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