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TPS62410DRCT Datasheet(PDF) 4 Page - Texas Instruments |
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TPS62410DRCT Datasheet(HTML) 4 Page - Texas Instruments |
4 / 36 page TPS62410 SLVS737A – FEBRUARY 2007 – REVISED JULY 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Input voltage on VIN (2) –0.3 7 V Voltage on EN, MODE/DATA, DEF_1 –0.3 VIN +0.3, ≤7 V Maximum current into MODE/DATA 500 μA Voltage on SW1, SW2 –0.3 7 V Voltage on ADJ2, FB1 –0.3 VIN +0.3, ≤7 V TJ(max) Maximum junction temperature 150 °C TA Operating ambient temperature –40 85 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN Supply voltage 2.5 6 V Output voltage range for adjustable voltage 0.6 VIN V TA Operating ambient temperature -40 85 °C TJ Operating junction temperature -40 125 °C 6.4 Thermal Information TPS62410 THERMAL METRIC(1) DRC (VSON) UNIT 10 PINS RθJA Junction-to-ambient thermal resistance 45.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 64.3 °C/W RθJB Junction-to-board thermal resistance 20.4 °C/W ψJT Junction-to-top characterization parameter 1.3 °C/W ψJB Junction-to-board characterization parameter 20.6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 2.8 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2007–2015, Texas Instruments Incorporated Product Folder Links: TPS62410 |
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