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TPS62171-Q1 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS62171-Q1 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 33 page 4 TPS62170-Q1, TPS62171-Q1, TPS62172-Q1 SLVSCK7A – DECEMBER 2014 – REVISED SEPTEMBER 2016 www.ti.com Product Folder Links: TPS62170-Q1 TPS62171-Q1 TPS62172-Q1 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network ground terminal. 6 Specifications 6.1 Absolute Maximum Ratings over operating junction temperature range (unless otherwise noted) (1) MIN MAX UNIT Pin voltage(2) VIN –0.3 20 V EN –0.3 VIN+0.3 SW -0.3 VIN+0.3 V FB, PG, VOS –0.3 7 V Power Good sink current PG 10 mA Operating junction temperature range, TJ –40 125 °C Storage temperature range, Tstg –65 150 °C (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) ±2000 V Charged device model (CDM), per AEC Q100-011 ±500 6.3 Recommended Operating Conditions over operating junction temperature range (unless otherwise noted) MIN TYP MAX UNIT VIN Supply voltage 3 17 V VOUT Output voltage range 0.9 6 V TJ Operating junction temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, . 6.4 Thermal Information THERMAL METRIC(1) TPS6217x-Q1 UNIT DSG (8 PINS) RθJA Junction-to-ambient thermal resistance 61.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 61.3 RθJB Junction-to-board thermal resistance 15.5 ψJT Junction-to-top characterization parameter 0.4 ψJB Junction-to-board characterization parameter 15.4 RθJC(bot) Junction-to-case (bottom) thermal resistance 8.6 |
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