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List

List.................................................................................................

Package outline...............................................................................

Features..........................................................................................

Maximum ratings .............................................................................

Rating and characteristic curves........................................................

Pinning information...........................................................................

Marking...........................................................................................

Suggested solder pad layout.............................................................

Packing information..........................................................................

Reel packing....................................................................................

Suggested thermal profiles for soldering processes.............................

High reliability test capabilities...........................................................

Mechanical data...............................................................................

Formosa MS

HFM101-MH1 THRU HFM107-MH1

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID

Issued Date

Revised Date

Revision

Page.

DS-121319

2014/01/20

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A

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Chip High Effciency Rectifiers