Package outline

Page 2

Formosa MS

2.0A Surface Mount Fast

Recovery Rectifiers-50-1000V

Features

Batch process design, excellent power dissipation offers

better reverse leakage current and thermal resistance.

Low profile surface mounted application in order to

optimize board space.

High current capability.

High surge current capability.

Glass passivated chip junction.

Lead-free parts meet RoHS requirments.

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PARAMETER

CONDITIONS

Forward rectified current

Forward surge current

Reverse current

Diode junction capacitance

Storage temperature

See Fig.2

8.3ms single half sine-wave (JEDEC methode)

f=1MHz and applied 4V DC reverse voltage

Symbol

MIN.

TYP.

MAX.

UNIT

I

O

I

FSM

I

R

C

J

T

STG

A

A

μA

pF

2.0

50

5.0

+175

-65

O

V

= V

T = 25 C

R

RRM

J

O

V

= V

T = 125 C

R

RRM

J

40

100

FFM201-BS

FFM202-BS

FFM203-BS

50

100

200

35

70

140

SYMBOLS

V

RRM

(V)

V

RMS

V

R

(V)

(V)

*1

*2

*3

*1 Repetitive peak reverse voltage

*2 RMS voltage

*3 Continuous reverse voltage

*4 Maximum forward voltage@I =2.0A

F

*5 Maximum Reverse recovery time, note 1

V

F

(V)

*4

FFM204-BS

FFM205-BS

400

600

280

420

1.30

-55 to +150

FFM206-BS

FFM207-BS

800

1000

560

700

t

rr

(ns)

*5

150

250

500

50

100

200

400

600

800

1000

O

( C)

Operating

temperature

T ,

J

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID

Issued Date

Revised Date

Revision

Page.

A

FFM201-BS THRU FFM207-BS

Dimensions in inches and (millimeters)

SMB-S

0.220(5.6)

0.205(5.2)

0.020(0.5) Typ.

0.138(3.5)

0.122(3.1)

0.075(1.9)

0.083(2.1)

0.067(1.7)

0.060(1.5)

0.040 (1.0) Typ.

0.040(1.0) Typ.

Mechanical data

Epoxy:UL94-V0 rated flame retardant

MIL-STD-750, Method 2026

•

Chip Fast Recovery Rectifiers

DS-121201

2012/03/08

-

A

7

Thermal resistance

R

θJA

50

Junction to ambient

Junction to case

30

R

θJC